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Felipe López Location
Filderstadt, BW, DE
Felipe López Work
2023 -now Head of Global Software @
2023 -2023 Team Leader Software | Product Owner @
2022 -2022 Product Owner - Senior Software Engineer R and D @
2020 -2022 Development Engineer @
2015 -2020 Application Engineer CNC @
2013 -2015 Application Engineer @
2008 -2012 Service Engineer @
Felipe López Education
Universidad de Zaragoza
Dipl. (Electrical and Electronics Engineering)
2007-2012
Baden-Wuerttemberg Cooperative State University (DHBW) 2017
Felipe López Summary
Felipe López, based in Filderstadt, BW, DE, is currently a Head of Global Software at ZEISS Semiconductor Manufacturing Technology. Felipe López brings experience from previous roles at ZEISS Semiconductor Manufacturing Technology, FANUC Europe and FANUC Deutschland GmbH. Felipe López holds a 2007 - 2012 Dipl. in Electrical and Electronics Engineering @ Universidad de Zaragoza. Felipe López has 1 emails on RocketReach.
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