Ethan Chen Email
Director, 3D Advanced Packaging @ AMD
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Ethan Chen Location
- United States
Ethan Chen Work
- 2023 -now Director, 3D Advanced Packaging @
- 2021 -2023 Principal Engineer and Director, Assembly and Test Program Manager – 3 and 4 Server and Networking Products @
- 2018 -2021 Senior Technical Program Manager, Advanced 2.5D and 3D Packaging Integration @
- 2015 -2018 Senior Technical Program Manager, SiP Technology Integration @
- 2014 -2015 Technical Program Manager, 3D Packaging Technology Integration @
- 2009 -2014 Sr. and Staff Packaging Engineer @
- 2005 -2009 Packaging Engineer @
Ethan Chen Education
- UC Irvine
Master of Science - MS (Electrical Engineering with Specialization in Microelectronics and Systems)
- University of California, Davis
Bachelor of Science - BS (Materials Science and Engineering)
Ethan Chen Summary
- Ethan Chen, based in United States, is currently a Director, 3D Advanced Packaging at AMD. Ethan Chen brings experience from previous roles at Intel Corporation. Ethan Chen holds a Master of Science - MS in Electrical Engineering with Specialization in Microelectronics and Systems @ UC Irvine. Ethan Chen has 1 emails on RocketReach.
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