Erwin Cohen Email & Phone Number
Lead RF Packaging Development Engineer @ Wolfspeed
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Erwin Cohen Location
- Durham, NC, US
Erwin Cohen Work
- Lead RF Packaging Development Engineer @ (October 2016 - Present)
- Principal Member of Technical Staff - Packaging Development @ (July 2015 - August 2016)
- Technical Lead and Program Manager, Advanced Package Development @ (January 2008 - June 2015)
- Senior Engineer, ASIC Package Methodology @ (November 2006 - January 2008)
- Senior Engineer Package Architecture @ (July 1998 - November 2006)
- Production Supervisor @ (January 1988 - August 1989)
- Process Engineer @ (July 1984 - July 1987)
Erwin Cohen Education
- Purdue University
PhD (Solid State Electrical Eng)
1990-1998 - University of Illinois Urbana-Champaign
Bachelor of Science (BS) (Mechanical Engineering)
1980-1984
Erwin Cohen Skills
- Team Leadership
- Signal Integrity
- Training
- Management
- Scrum
- Leadership Development
- Testing
- Unix
- Software Development
- Semiconductors
- SDLC
- Cross-functional Team Leadership
- ASIC
- Enterprise Software
- Processors
- Microprocessors
- Lean Manufacturing
- Leadership
- Embedded Systems
- Debugging
- System Architecture
- Product Development
- Program Management
- EDA
- Integration
- Product Management
- Requirements Analysis
- Perl
- CMOS
- Simulations
- High Performance Computing
- Software Engineering
- Engineering Management
- IC
- Development
- Program Manager
- Motors
- Cross Functional Team Leadership
Erwin Cohen Summary
- Erwin Cohen, based in Durham, NC, US, is currently a Lead RF Packaging Development Engineer at Wolfspeed, A Cree Company. Erwin Cohen brings experience from previous roles at GLOBALFOUNDRIES and IBM. Erwin Cohen holds a 1990 - 1998 PhD in Solid State Electrical Eng @ Purdue University. With a robust skill set that includes Team Leadership, Signal Integrity, Training, Management, Scrum and more.
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