Erwin Cohen Email & Phone Number
Lead RF Packaging Development Engineer @ Wolfspeed
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Erwin Cohen Location
- Durham, NC, US
Erwin Cohen Work
- 2016 -now Lead RF Packaging Development Engineer @
- 2015 -2016 Principal Member of Technical Staff - Packaging Development @
- 2008 -2015 Technical Lead and Program Manager, Advanced Package Development @
- 2006 -2008 Senior Engineer, ASIC Package Methodology @
- 1998 -2006 Senior Engineer Package Architecture @
- 1988 -1989 Production Supervisor @
- 1984 -1987 Process Engineer @
Erwin Cohen Education
- Purdue University 1990-1998
- University of Illinois Urbana-Champaign 1980-1984
Erwin Cohen Skills
- Team Leadership
- Signal Integrity
- Training
- Management
- Scrum
- Leadership Development
- Testing
- Unix
- Software Development
- Semiconductors
- SDLC
- Cross-functional Team Leadership
- ASIC
- Enterprise Software
- Processors
- Microprocessors
- Lean Manufacturing
- Leadership
- Embedded Systems
- Debugging
- System Architecture
- Product Development
- Program Management
- EDA
- Integration
- Product Management
- Requirements Analysis
- Perl
- CMOS
- Simulations
- High Performance Computing
- Software Engineering
- Engineering Management
- IC
- Development
- Program Manager
- Motors
- Cross Functional Team Leadership
Erwin Cohen Summary
- Erwin Cohen, based in Durham, NC, US, is currently a Lead RF Packaging Development Engineer at Wolfspeed, A Cree Company. Erwin Cohen brings experience from previous roles at GLOBALFOUNDRIES and IBM. Erwin Cohen holds a 1990 - 1998 Purdue University. With a robust skill set that includes Team Leadership, Signal Integrity, Training, Management, Scrum and more. Erwin Cohen has 1 emails on RocketReach.
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