Erwin Cohen, based in Durham, NC, US, is currently a Lead RF Packaging Development Engineer at Wolfspeed, A Cree Company. Erwin Cohen brings experience from previous roles at GLOBALFOUNDRIES and IBM. Erwin Cohen holds a 1990 - 1998 Purdue University. With a robust skill set that includes Team Leadership, Signal Integrity, Training, Management, Scrum and more. Erwin Cohen has 1 emails on RocketReach.
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