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Eric Cheam Location
Singapore
Eric Cheam Work
2024 -now Package R and D Package Definition @
2022 -2024 Principle Engineer Package R and D @
2019 -2022 Staff Engineer External Manufacturing Package R and D @
2017 -2019 Senior Package Designer @
2015 -2017 Package Development Engineer @
2011 -2012 CAD Development Engineer @
2008 -2011 Failure Analysis Engineer @
Eric Cheam Education
Northumbria University
Master of Science (MSc) (Microelectronic and Communication Engineering)
2013-2014
University Tenaga Nasional
Bachelor's degree (Electrical and Electronics Engineering)
2003-2008
Eric Cheam Summary
Eric Cheam, based in Singapore, is currently a Package R and D Package Definition at Infineon Technologies. Eric Cheam brings experience from previous roles at Nexperia and ON Semiconductor. Eric Cheam holds a 2013 - 2014 Master of Science (MSc) in Microelectronic and Communication Engineering @ Northumbria University. Eric Cheam has 1 emails on RocketReach.
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