Director, Packaging Engineering @ (April 2007 - February 2013)
Sr. Manager, Package Development Engineering @ (January 1999 - January 2007)
Package Engineering Manager @ Silicon Systems (acquired by Texas Instruments) (January 1986 - January 1999)
Efren Lacap Summary
Efren Lacap, based in Los Gatos, CA, US, is currently a Director, Packaging Engineering and Supplier Liasion at ACCO Semiconductor. Efren Lacap brings experience from previous roles at Amalfi Semiconductor/RFMD, Volterra Semiconductor Corp. and Silicon Systems (acquired by Texas Instruments). Efren Lacap has 1 mobile phone numbers on RocketReach.
Looking for a different Efren Lacap?
Find contact details for 700 million professionals.