Dwight Lee Email
Package NPI engineer @ Qualcomm
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Dwight Lee Location
- Taiwan
Dwight Lee Work
- 2026 -now Package NPI engineer @
- 2017 -2026 Advanced Package development engineer @
- 2016 -2017 Sr. R and D packaging Engineer @
- 2015 -2016 Sr. Technical and Quality Enginner @
- 2011 -2015 Product Development of ATT Bumping @
Dwight Lee Education
- California State University-Northridge
Master's degree (Materials Engineering)
2009-2011 - Tatung University
Bachelor's degree (Materials Science)
2001-2005
Dwight Lee Summary
- Dwight Lee, based in Taiwan, is currently a Package NPI engineer at 美商高通國際股份有限公司. Dwight Lee brings experience from previous roles at 英特爾, STMicroelectronics and Amkor technology. Dwight Lee holds a 2009 - 2011 Master's degree in Materials Engineering @ California State University-Northridge. Dwight Lee has 2 emails on RocketReach.
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