Dongho Lee's Location
Nanuet, New York, United States
Dongho Lee's Work
- VLSI Circuit and Physical Design Engineer @ IBM
- VLSI Circuit Design Engineer @ Lockheed Martin
Dongho Lee's Education
- Harvard Business School
HBS Alumnus - PLDA (Executive Education)
2021 - 2022 - Columbia University in the City of New York
Electrical Engineer (Electrical Engineering)
2005 - 2010 - Cornell University
Master of Engineering (Electrical Engineering)
1995 - 1997
- Rensselaer Polytechnic Institute
Bachelor of Science (Electrical Engineering)
1992 - 1995
Dongho Lee's Skills
- VLSI
- Microprocessors
- Circuit Design
- IC
- CMOS
- Physical Design
- Layout Verification
- Analog
- Simulations
- EDA
Dongho Lee's Summary
Dongho Lee, based in Nanuet, New York, United States, is currently a VLSI Circuit and Physical Design Engineer at IBM, bringing experience from previous roles at Lockheed Martin. Dongho Lee holds a 2021 - 2022 HBS Alumnus - PLDA in Executive Education @ Harvard Business School. With a robust skill set that includes VLSI, Microprocessors, Circuit Design, IC, CMOS and more, Dongho Lee contributes valuable insights to the industry. Dongho Lee has 4 emails on RocketReach.
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