Custom Thin Film Interconnect Solutions Thin film interconnect devices manufactured for today’s demanding needs. Servicing the microwave, telecommunications and fiber optic industries for 38 years. DITF's capabilities for high density, low TCR, close thermal tracking and high stability devices are unsurpassed in quality and on time delivery. Metalization and patterning capabilities include high frequency RF circuitry (0.0005” lines & spaces) and thick (up to 0.005”) Cu traces incorporated on the same substrate to reduce footprint and overall package size. Contact the factory with your requirements. Passive Components •Attenuators •Capacitors •Hybrids •Inductors •Resistors Semiconductors/Integrated Circuits •Thin Film Circuits
| Website | http://www.ditf.com |
| Revenue | $6 million |
| Employees | 13 (1 on RocketReach) |
| Address | 2245 Meridian Blvd, #e, Minden, Nevada 89423, US |
| Phone | +1 775-782-1041 |
| Fax | (775) 782-1044 |
| Industry | Defense & Space, Aerospace & Defense, Manufacturing |
| Web Rank | 12 Million |
| Keywords | Thin Film Technology, Custom Interconnect Solutions, High Density Interconnect, Electronic Interconnect, Microwave Circuits, Fiber Optic Interconnect, Rf Interconnect |
| Competitors | 3M, Parker Hannifin, TE Connectivity, Molex, Amphenol, Belden Inc., HARTING Technology Group, Hirose Electric Co., Ltd., LEMO connector, Nicomatic +39 more (view full list) |
| SIC | SIC Code 37 Companies, SIC Code 372 Companies |
| NAICS | NAICS Code 33 Companies, NAICS Code 336 Companies |
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The DITF Interconnect Technology annual revenue was $6 million in 2026.
1 people are employed at DITF Interconnect Technology.
DITF Interconnect Technology is based in Minden, Nevada.
The NAICS codes for DITF Interconnect Technology are [33, 336].
The SIC codes for DITF Interconnect Technology are [37, 372].