DIMECA Competitors

Amphenol is one of the largest manufacturers on the planet you’ve never heard of. Founded in 1932 and headquartered out of Connecticut, Amphenol is a Fortune 500 company with more than 90,000 employees throughout the world. Our products are a key ingredient in the electronic devices that you use every day. From the cell phone in your pocket and the car you drive, to the network equipment behind your favorite app and website, Amphenol products are everywhere.

Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, Mexico, and the USA.

APCT is a leading manufacturer of high reliability printed circuit boards. We strive daily to be able to answer our customer’s needs. We work diligently to offer with confidence technology solutions from standard rigid through-hole, to the more advanced HDI via in pad product, to Flex and Rigid Flex. BUSINESS SUMMARY Annual Revenue: $100+ Million Facility: 180,000 Sq. Ft. Employees: 500+ Manufacturing Sites: 4 Sites Global Distribution Sites: 5 Sites Working Shifts: 3 Shifts - 24 Hours/Day CERTIFICATIONS • ISO 9001 Certified • AS9100D Certified • MIL-PRF-31032 Certified (MIL-P-55110 Certified) • MIL-P-50884 Certified • ITAR Registered at all sites • IPC 6012 Class 3 & 3A • IPC-6013 Class 3 & 3A • IPC-1791 Trusted Electronics Qualified Manufacturers Listing (QML)* *APCT Anaheim & Orange County Only QUANTITIES • Prototypes • Mid-Production • Production Orders through Offshore Partnerships DOMESTIC/OFFSHORE TECHNOLOGIES RIGID THROUGH-HOLE Standard: 2 – 28 Layers Advanced: 30 – 38 Layers Development (NPI only): 40+ Layers HDI; BLIND/BURIED/STACKED VIA Lam Cycles: Up to 8x Micro BGA Pitch: .2 Millimeters FLEX / RIGID-FLEX Standard Flex: 1 – 6 Layers Rigid Flex: 4 – 22 Layers Rigid Flex HDI Lam Cycles: Up to 2x DOMESTIC LEAD TIMES RIGID THROUGH-HOLE Standard: 20 Days 2 – 10 Layers: 24 Hours 12 – 24 Layers: 48 Hours HDI; BLIND/BURIED/STACKED VIA Via in Pad Standard: 20 Days Via in Pad Expedited: 3 Days HDI Standard: 25 Days HDI Expedited: 5 – 12 Days FLEX / RIGID-FLEX Flex 1 – 6 Layers Standard: 25 Days Flex 1 – 6 Layers Expedited: 5-15 Days Rigid Flex 4-22 Layers Standard: 25 Days Rigid Flex 4-22 Layers Expedited: 20+ Days Rigid Flex HDI 2x Lam Cycles: 30 Days APCT GLOBAL APCT Global offers complete custom program management solutions. Every customer has unique and specific needs. We build solutions that fit those needs. APCT has the resources domestically and abroad to offer peace of mind from initial