Dickson Lee's Location
Syosset, NY, US
Dickson Lee's Work
Dickson Lee's Education
Dickson Lee's Skills
Dickson Lee's Summary
Dickson Lee, based in Syosset, NY, US, is currently a Product Engineer at Microchip Technology, bringing experience from previous roles at Microchip Technology, SMSC, Telephonics Corporation and IBM. Dickson Lee holds a 1984 - 1987 Master of Science (MS) in Electrical and Electronics Engineering @ Polytechnic University. With a robust skill set that includes Hardware Architecture, Debugging, Functional Verification, Perl, RTL design and more, Dickson Lee contributes valuable insights to the industry. Dickson Lee has 1 email on RocketReach.