Dickson Lee Location
Syosset, NY, US
Dickson Lee Work
Dickson Lee Education
Dickson Lee Skills
Dickson Lee Summary
Dickson Lee, based in Syosset, NY, US, is currently a Product Engineer at Microchip Technology. Dickson Lee brings experience from previous roles at Microchip Technology, SMSC, Telephonics Corporation and IBM. Dickson Lee holds a 1984 - 1987 Master of Science (MS) in Electrical and Electronics Engineering @ Polytechnic University. With a robust skill set that includes Hardware Architecture, Debugging, Functional Verification, Perl, RTL design and more. Dickson Lee has 2 emails and 1 mobile phone numbers on RocketReach.