Dickson Lee Email & Phone Number
Product Engineer @ Microchip Technology Inc.
5 free lookup(s). No credit card required.
If you need more lookups,
subscriptions start at $34 USD/month.
Dickson Lee Location
- Syosset, NY, US
Dickson Lee Work
- Product Engineer @ (August 2018 - Present)
- Test and Product Engineer @ (February 2009 - Present)
- Sr. Design Engineer @ SMSC (November 2000 - February 2009)
- Sr. Design Engineer @ (March 1998 - October 2000)
- Design Engineer @ (August 1997 - February 1998)
- System Engineer @ (March 1996 - June 1997)
- Design Engineer @ (July 1995 - February 1996)
- Contract Engineer @ (April 1991 - June 1995)
- Design Engineer @ (February 1983 - August 1990)
Dickson Lee Education
- New York University - Polytechnic School of Engineering
Master of Science (MS) (Electrical and Electronics Engineering)
1984-1987 - New York University - Polytechnic School of Engineering
Bachelor of Science (BS) (Electrical and Electronics Engineering)
1978-1983
Dickson Lee Skills
- ASIC
- Altera
- Analog
- C++
- CMOS
- Cadence
- Debugging
- Embedded Systems
- FPGA
- Firmware
- Functional Verification
- Hardware Architecture
- IC
- Integrated Circuit Design
- Microcontrollers
- Mixed Signal
- Orcad
- PCB design
- Perl
- RTL coding
- RTL design
- Semiconductor Industry
- Semiconductors
- Simulations
- SoC
- Static Timing Analysis
- Syntricity yield analysis
- SystemVerilog
- TCL
- Testing
- USB
- VHDL
- Verilog
- Xilinx
Dickson Lee Summary
- Dickson Lee, based in Syosset, NY, US, is currently a Product Engineer at Microchip Technology. Dickson Lee brings experience from previous roles at Microchip Technology, SMSC, Telephonics Corporation and IBM. Dickson Lee holds a 1984 - 1987 Master of Science (MS) in Electrical and Electronics Engineering @ New York University - Polytechnic School of Engineering. With a robust skill set that includes ASIC, Altera, Analog, C++, CMOS and more. Dickson Lee has 2 emails and 1 mobile phone numbers on RocketReach.
Looking for a different Dickson Lee?
Find contact details for 700 million professionals.
Others Named Dickson Lee
Dickson Lee
Product Engineer
Syosset, NY, US
Dickson Lee
First Vice President
Singapore
Dickson Lee
Managing Director
Singapore, SG
Dickson Lee
Investment Manager
Florida, United States
Dickson Lee
Assistant Director
Singapore
Dickson Lee
Vice President, FP and A - Annapurna Interactive
Santa Monica, CA, US
Top Microchip Technology Inc. Employees
Bruce Weyer
Vice President, Fpga Business Unit
California, United States
Rishi Vasuki
Vice President, Wireless Solutions Group Business Unit
Chandler, AZ, US
John Costello
Corporate Vice President of Government Affairs
Santa Clarita, CA, US
Steve Sanghi
CEO and President
Chandler, AZ, US
Robert Williams
CISO and Corporate Vice President
Chandler, AZ, US
Jon Buck
Vice President, Software and Solutions Engineering
San Jose, CA, US
Tom Grune
Vice President America's Sales
Chandler, AZ, US
Clayton Pillion
Vice President, High-Power Solutions Business Unit
Chandler, AZ, US
Eric Bjornholt
Chief Financial Officer
Chandler, AZ, US
Greg Robinson
Corporate Vice President Microcontroller Business Unit
Queen Creek, AZ, US
Patrick Johnson
Senior Vice President
Chandler, AZ, US
Fanie Duvenhage
Senior Vice President Analog and Discrete Products
Chandler, AZ, US
Mathew Bunker
Vice President of Pacrim Manufacturing
Chandler, AZ, US
John Alex
Ceo
Las Vegas, NV, US
G2 Crowd Trusted
300K+ Plugin Users
© 2026 RocketReach.co