Dickson Lee Email & Phone Number
Product Engineer @ Microchip Technology Inc.
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Dickson Lee Location
- Syosset, NY, US
Dickson Lee Work
- 2018 -now Product Engineer @
- 2009 -now Test and Product Engineer @
- 2000 -2009 Sr. Design Engineer @ SMSC
- 1998 -2000 Sr. Design Engineer @
- 1997 -1998 Design Engineer @
- 1996 -1997 System Engineer @
- 1995 -1996 Design Engineer @
- 1991 -1995 Contract Engineer @
- 1983 -1990 Design Engineer @
Dickson Lee Education
- Polytechnic University
Master of Science (MS) (Electrical and Electronics Engineering)
1984-1987 - Polytechnic University
Bachelor of Science (BS) (Electrical and Electronics Engineering)
1978-1983
Dickson Lee Skills
- Hardware Architecture
- Debugging
- Functional Verification
- Perl
- RTL design
- PCB design
- Analog
- ASIC
- Verilog
- Integrated Circuit Design
- Microcontrollers
- USB
- Xilinx
- Cadence
- Syntricity Yield Analysis
- TCL
- Mixed Signal
- Embedded Systems
- CMOS
- Semiconductor Industry
- Testing
- FPGA
- RTL coding
- SoC
- VHDL
- C++
- Altera
- SystemVerilog
- Simulations
- Semiconductors
- Firmware
- Static Timing Analysis
- Orcad
- IC
Dickson Lee Summary
- Dickson Lee, based in Syosset, NY, US, is currently a Product Engineer at Microchip Technology. Dickson Lee brings experience from previous roles at Microchip Technology, SMSC, Telephonics Corporation and IBM. Dickson Lee holds a 1984 - 1987 Master of Science (MS) in Electrical and Electronics Engineering @ Polytechnic University. With a robust skill set that includes Hardware Architecture, Debugging, Functional Verification, Perl, RTL design and more. Dickson Lee has 2 emails and 1 mobile phone numbers on RocketReach.
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