Thin Film Module Equipment Engineer @ (August 2018 - Present)
Full Time Degree Student @ (September 2014 - June 2018)
Academic Tutor @ Tuition Center Han (September 2017 - March 2018)
Event Coordinator @ TKP Conference Center (August 2017 - February 2018)
Dick Teh Education
Universiti Putra Malaysia
Bachelor's degree (Electrical and Electronics Engineering)
2014-2018
Malacca Matriculation College
Foundation degree (Science Module)
2013-2014
Dick Teh Skills
Failure Mode and Effects Analysis (FMEA)
Microsoft Office
Management
Microsoft Word
Leadership
Microsoft PowerPoint
Microsoft Excel
Dick Teh Summary
Dick Teh, based in Singapore, is currently a Thin Film Module Senior Equipment Engineer at United Microelectronics Corporation (UMC). Dick Teh brings experience from previous roles at United Microelectronics Corporation (UMC), Universiti Putra Malaysia, Tuition Center Han and TKP Conference Center. Dick Teh holds a 2014 - 2018 Bachelor's degree in Electrical and Electronics Engineering @ Universiti Putra Malaysia. With a robust skill set that includes Failure Mode and Effects Analysis (FMEA), Microsoft Office, Management, Microsoft Word, Leadership and more. Dick Teh has 3 emails on RocketReach.
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