Devin Wu Email
PMTS Packaging Engineer @ AMD
5 free lookup(s). No credit card required.
If you need more lookups,
subscriptions start at $34 USD/month.
Devin Wu Location
- Taiwan
Devin Wu Work
- 2022 -now PMTS Packaging Engineer @
- 2021 -2022 Principal Package Integration Engineer @
- 2013 -2020 Principle Package Process Integration Engineer @
- 2008 -2013 Senior Engineer @
- 2005 -2008 Engineer @
Devin Wu Education
- National Tsing Hua University
Master of Science (MS) (Engineering and System Science)
2000-2002
Devin Wu Skills
- Solder formation by printing and pasting
- Wafer bumping processes integration
- Dielectric film formation
- Semiconductor Industry
- Design of Experiments
- Failure Analysis
- CVD
- PVD
- Plating
- E-less plating
- E Less Plating
Devin Wu Summary
- Devin Wu, based in Taiwan, is currently a PMTS Packaging Engineer at AMD. Devin Wu brings experience from previous roles at TSMC. Devin Wu holds a 2000 - 2002 Master of Science (MS) in Engineering and System Science @ National Tsing Hua University. With a robust skill set that includes Solder formation by printing and pasting, Wafer bumping processes integration, Dielectric film formation, Semiconductor Industry, Design of Experiments and more. Devin Wu has 1 emails on RocketReach.
Looking for a different Devin Wu?
Find contact details for 700 million professionals.
Others Named Devin Wu
Top AMD Employees
Cheng-Feng Chang
Corporate Vice President
Cupertino, CA, US
Eamon O'Keeffe
Sr. Director, Board Operations
Santa Clara, CA, US
Ram Peddibhotla
Corp VP, AI Group
Santa Clara, CA, US
Tony Venuto
President
Horsham, PA, US
G2 Crowd Trusted
300K+ Plugin Users
© 2026 RocketReach.co