Devin Wu Location
Taiwan
Devin Wu Work
Devin Wu Education
Devin Wu Skills
Devin Wu Summary
Devin Wu, based in Taiwan, is currently a PMTS Packaging Engineer at AMD. Devin Wu brings experience from previous roles at TSMC. Devin Wu holds a 2000 - 2002 Master of Science (MS) in Engineering and System Science @ National Tsing Hua University. With a robust skill set that includes Solder formation by printing and pasting, Wafer bumping processes integration, Dielectric film formation, Semiconductor Industry, Design of Experiments and more. Devin Wu has 2 emails on RocketReach.