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Devin Clark Location
Chapel Hill, NC, US
Devin Clark Work
Packaging Engineer III - Global Packaging Lab Lead @ (April 2025 - Present)
Packaging Engineer III @ (April 2024 - April 2025)
Packaging Engineer II @ (September 2022 - April 2024)
Packaging Development Engineer @ (January 2020 - September 2022)
Global Packaging Engineer @ (June 2018 - July 2019)
Structural Design Supervisor @ (July 2017 - June 2018)
Packaging Engineer @ (February 2016 - April 2017)
Packaging Science Student @ (May 2011 - December 2015)
Structural Design Intern @ (January 2015 - July 2015)
Devin Clark Education
Clemson University
Bachelor's Degree (Packaging Science)
2011-2015
Chapin High School
High School
2007-2011
Devin Clark Summary
Devin Clark, based in Chapel Hill, NC, US, is currently a Packaging Engineer III - Global Packaging Lab Lead at Teleflex. Devin Clark brings experience from previous roles at Teleflex and Lenovo. Devin Clark holds a 2011 - 2015 Bachelor's Degree in Packaging Science @ Clemson University. Devin Clark has 4 emails and 2 mobile phone numbers on RocketReach.
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