Devin Clark Email & Phone Number
Packaging Engineer III - Global Packaging Lab Lead @ Teleflex
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Devin Clark Location
- Chapel Hill, NC, US
Devin Clark Work
- 2025 -now Packaging Engineer III - Global Packaging Lab Lead @
- 2024 -2025 Packaging Engineer III @
- 2022 -2024 Packaging Engineer II @
- 2020 -2022 Packaging Development Engineer @
- 2018 -2019 Global Packaging Engineer @
- 2017 -2018 Structural Design Supervisor @
- 2016 -2017 Packaging Engineer @
- 2011 -2015 Packaging Science Student @
- 2015 -2015 Structural Design Intern @
Devin Clark Education
- Clemson University 2011-2015
- Chapin High School 2007-2011
Devin Clark Summary
- Devin Clark, based in Chapel Hill, NC, US, is currently a Packaging Engineer III - Global Packaging Lab Lead at Teleflex. Devin Clark brings experience from previous roles at Teleflex and Lenovo. Devin Clark holds a 2011 - 2015 Clemson University. Devin Clark has 4 emails and 2 mobile phone numbers on RocketReach.
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