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Devin Clark Location
Chapel Hill, NC, US
Devin Clark Work
Packaging Engineer III - Global Packaging Lab Lead @ (April 2025 - Present)
Packaging Engineer III @ (April 2024 - April 2025)
Packaging Engineer II @ (September 2022 - April 2024)
Packaging Development Engineer @ (January 2020 - September 2022)
Global Packaging Engineer @ (June 2018 - July 2019)
Structural Design Supervisor @ (July 2017 - June 2018)
Packaging Engineer @ Honda Power Equipment (February 2016 - April 2017)
Packaging Science Student @ (May 2011 - December 2015)
Structural Design Intern @ (January 2015 - July 2015)
Devin Clark Education
Clemson University
Bachelor's Degree (Packaging Science)
2011-2015
Chapin High School
High School
2007-2011
Devin Clark Skills
Adobe Creative Suite
ArtiosCAD
Cape Pack
Consumer Package Goods
Illustrator
Impact Cad
Kongsberg
Microsoft Office
Package Testing
Project Management
SolidWorks
Structural Design
Zund
Devin Clark Summary
Devin Clark, based in Chapel Hill, NC, US, is currently a Packaging Engineer III - Global Packaging Lab Lead at Teleflex. Devin Clark brings experience from previous roles at Teleflex and Lenovo. Devin Clark holds a 2011 - 2015 Bachelor's Degree in Packaging Science @ Clemson University. With a robust skill set that includes Adobe Creative Suite, ArtiosCAD, Cape Pack, Consumer Package Goods, Illustrator and more. Devin Clark has 4 emails and 2 mobile phone numbers on RocketReach.
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