Derek Tseng's Location

Buena Park, CA, US

Derek Tseng's Work

  • Hardware Engineer @ Boeing
  • Researcher @ Bio- and Nano-Photonics Lab of UCLA
  • Lead Mechanical Design Engineer @ Holomic LLC

Derek Tseng's Education

  • University of California, Los Angeles

    Master's degree (Electrical and Electronics Engineering)

    2008 - 2010
  • University of California San Diego

    Bachelor's degree (Electrical and Electronics Engineering)

    2001 - 2004

Derek Tseng's Skills

  • Research And Development R&D
  • Solidworks
  • 3D Printing
  • Rapid Prototyping
  • AutoCAD
  • Software
  • Research and Development

Derek Tseng's Summary

Derek Tseng, based in Buena Park, CA, US, is currently a Hardware Engineer at Boeing, bringing experience from previous roles at Bio- and Nano-Photonics Lab of UCLA, Holomic LLC and InnoSense LLC. Derek Tseng holds a 2008 - 2010 Master's degree in Electrical and Electronics Engineering @ University of California, Los Angeles. With a robust skill set that includes Research And Development R&D, Solidworks, 3D Printing, Rapid Prototyping, AutoCAD and more, Derek Tseng contributes valuable insights to the industry. Derek Tseng has 1 email on RocketReach.

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