Darryl Becker Email & Phone Number
Electronic Packaging Engineer @ IBM
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Darryl Becker Location
- Rochester, MN, US
Darryl Becker Work
- Electronic Packaging Engineer @ (December 1983 - Present)
Darryl Becker Education
- Iowa State University
BSEE
Darryl Becker Skills
- ASIC
- Application-Specific Integrated Circuits (ASIC)
- Debugging
- Electrical Engineering
- Hardware
- Hardware Architecture
- Integration
- Linux
- Perl
- Program Management
- Semiconductors
- Software Development
- Testing
- Unix
- Verilog
- Application Specific Integrated Circuits Asic
- Application Specific Integrated Circuits
Darryl Becker Summary
- Darryl Becker, based in Rochester, MN, US, is currently a Electronic Packaging Engineer at IBM. Darryl Becker holds a BSEE @ Iowa State University. With a robust skill set that includes ASIC, Application-Specific Integrated Circuits (ASIC), Debugging, Electrical Engineering, Hardware and more.
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