2024 -
now Sales VP and Assistant to the Chairman @
2021 -
2024 Account Executive @
2020 -
2021 Account Manager @
2015 -
2020 Sr. Sales Engineer @
2007 -
2015 Account Manager @
2006 -
2007 Account Manager @ Phino
2002 -
2006 Market Research @ 日本ユニコム(株)
Daniel Weng Education
國立清華大學
Master of Business Administration - MBA (MBA)
2022
-
2024
國立臺灣大學
Graduate Credit Program in Business Administration, School of Professional and Continuing Studies (Business/Commerce, General)
2010
-
2014
National Taiwan University 2001null
Daniel Weng Skills
Account Management
Sales Management
Product Marketing
Product Management
Product Development
Cross-functional Team Leadership
Manufacturing
Supply Chain Management
Business Strategy
Project Management
Operations Management
Process Improvement
Customer Service
Program Management
Key Account Management
Solution Selling
Channel Partners
Cross Functional Team Leadership
Daniel Weng Summary
Daniel Weng, based in Taipei City, Taiwan, Taiwan, is currently a Sales VP and Assistant to the Chairman at JPC Connectivity. Daniel Weng brings experience from previous roles at Amphenol Global Interconnect Systems, Molex Connected Enterprise Solutions and JPC Connectivity. Daniel Weng holds a 2022 - 2024 Master of Business Administration - MBA in MBA @ 國立清華大學. With a robust skill set that includes Account Management, Sales Management, Product Marketing, Product Management, Product Development and more. Daniel Weng has 1 emails on RocketReach.
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