Daniel Wandera Email & Phone Number

Wafer Assembly TD Engineer @ Intel Corporation

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Daniel Wandera Location

Portland, OR, US

Daniel Wandera Work

2024 - now Wafer Assembly TD Engineer @ Intel Corporation
2022 - 2024 Packaging R and D Engineer @ Intel Corporation
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2015 - 2021 Polymer Scientist and Engineer @ ENTEK International

2014 - 2015 Research and Development Lead @ Hydration Technology Innovations, LLC
2012 - 2014 Sr. Research Scientist @ Hydration Technology Innovations, LLC
2007 - 2012 Graduate Research Assistant @ Clemson University
2007 - 2012 Teaching Assistant @ Clemson University

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Daniel Wandera Education

Clemson University
2007 - 2012
Makerere University
2002 - 2005

Daniel Wandera Skills

Characterization
Spectroscopy
Chemical Engineering

AFM
Membrane
Polymers
HPLC
R&D
Materials Science
Research

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Daniel Wandera Summary

Daniel Wandera, based in Portland, OR, US, is currently a Wafer Assembly TD Engineer at Intel Corporation. Daniel Wandera brings experience from previous roles at Intel Corporation, ENTEK International and Hydration Technology Innovations, LLC. Daniel Wandera holds a 2007 - 2012 Clemson University. With a robust skill set that includes Characterization, Spectroscopy, Chemical Engineering, AFM, Membrane and more. Daniel Wandera has 4 emails and 1 mobile phone numbers on RocketReach.

Daniel Wandera Emails

Found 4 emails

Daniel Wandera Phone Numbers

Found 3 phone numbers

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Daniel Wandera

Wafer Assembly TD Engineer at Intel Corporation

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Daniel Wandera

Head Of Legal at Ramco Group

Kenya
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Daniel Wandera

Accountant at Chuka University

Kenya
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