Daniel Wandera Email & Phone Number

Wafer Assembly TD Engineer @ Intel Corporation

View Daniel's Email & Phone Number

5 free lookup(s). No credit card required.

If you need more lookups, subscriptions start at $34 USD/month.

Daniel Wandera Location

Portland, OR, US

Daniel Wandera Work

2024 -now Wafer Assembly TD Engineer @
2022 -2024 Packaging R and D Engineer @
2015 -2021 Polymer Scientist and Engineer @
2014 -2015 Research and Development Lead @ Hydration Technology Innovations, LLC
2012 -2014 Sr. Research Scientist @ Hydration Technology Innovations, LLC
2007 -2012 Graduate Research Assistant @
2007 -2012 Teaching Assistant @

Daniel Wandera Education

Clemson University 2007-2012
Makerere University 2002-2005

Daniel Wandera Skills

Characterization
Spectroscopy
Chemical Engineering
AFM
Membrane
Polymers
HPLC
R&D
Materials Science
Research
Science
Engineering
Filtration
Water Quality
Materials
Water Treatment
Coatings
Water
Scanning Electron Microscopy
Water Resources
IR spectroscopy
Experimentation
Project Management
Sustainability
Energy
Microsoft Office
Design of Experiments
Wastewater Treatment
Technical Writing
Organic Chemistry
UV/Vis
Optimizations
Ultrafiltration
Differential Scanning Calorimetry
FTIR
Process Simulation
Ellipsometry
Polymer Characterization
Kinetics
Optimization
Protein Purification
Biotechnology
Downstream Processing
Membrane Separations
Biologics
Polymer Science
Chromatography
Intellectual Property
Water Purification
Academic Research
Tss
Velocity
Suppliers
Chemical
Chemistry
Undergraduate
Commercialization
Students
Manuscript
Hydration
Mentoring
Access Control
Bioseparations
Scanning Electron
SEP IRA
Las Vegas
Technology Products
Co Authored
Uganda
Clsm
Treatment
Water Filtration
Assessment
Travel
Conductivity
Film
Nanofiltration
Management
Design
Modification
German
North America
Tds
TOC
Nashville
Chain
Density
Publications
Collaborative
Surface Modification
Foundation
Atrp
Business Services
Cell
Desalination
Atlanta
Performance Appraisal
Pretreatment
Sales Engineering
Cleaning
Cultivate
Corporations
Training
Feeds
Downstream Oil and Gas
Mechanisms
Laboratory
Cellulose
R
Academic Institutions
Wastewater
Ion
Houston
Affinity
Poster Presentations
Cod
Accountability
Conceiving
Gas Separation
Communication
Purification
Posters
Bet
Lake Homes
High Throughput
Atom
Project
Surface
Presentations
Unit Operations
Responsibility
Minneapolis
Performance Testing Tools
Rendering
SALT
Germany
Internships
Teaching
Interfaces
Microsoft Exchange
Contact Angle
Academic
SCI Clearance
Business Insights
Polymerization
Image Capture
Team Oriented
Differential Scanning
Separation
Chemical Industry
SEM
Formulation
Scientists
Problem Solving
Architecture
Bod
Strength Training
Competition

Daniel Wandera Summary

Daniel Wandera, based in Portland, OR, US, is currently a Wafer Assembly TD Engineer at Intel Corporation. Daniel Wandera brings experience from previous roles at Intel Corporation, ENTEK International and Hydration Technology Innovations, LLC. Daniel Wandera holds a 2007 - 2012 Clemson University. With a robust skill set that includes Characterization, Spectroscopy, Chemical Engineering, AFM, Membrane and more. Daniel Wandera has 4 emails and 2 mobile phone numbers on RocketReach.