Firmware Engineer @ (February 2024 - November 2024)
Graduate Electronics Engineer @ (September 2022 - February 2024)
Customer Assistant @ (September 2017 - March 2022)
Firmware Engineering MEng Placement @ (June 2021 - December 2021)
Class 1 Electronics Manager @ (February 2020 - July 2021)
Firmware Engineering Summer Placement @ (June 2020 - August 2020)
Class 1 Electronics Team Member @ (September 2019 - February 2020)
Firmware Engineering Summer Placement @ (June 2019 - August 2019)
Hardware Engineering Summer Placement @ (June 2018 - August 2018)
Daniel Tee Education
The University of Edinburgh
Master of Engineering - MEng (Electronics and Computer Science)
2017-2022
Monifieth High School 2011-2017
Daniel Tee Summary
Daniel Tee, based in Edinburgh, GB, is currently a Senior Firmware Engineer at Leonardo. Daniel Tee brings experience from previous roles at Leonardo and Tesco. Daniel Tee holds a 2017 - 2022 Master of Engineering - MEng in Electronics and Computer Science @ The University of Edinburgh. Daniel Tee has 2 emails on RocketReach.
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