Daniel Talmon Email & Phone Number
Physical Design Lead @ Rain
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Daniel Talmon Location
- California, United States
Daniel Talmon Work
- 2023 -now Physical Design Lead @
- 2022 -2023 Physical Design Lead @
- 2021 -2022 Principal Engineer Physical Design @
- 2020 -2021 Sr. Principal Physical Design engineer @
- 2017 -2020 Principal Physical Design engineer @
- 2015 -2017 Sr. Staff Physical Design engineer @
- 2012 -2015 Sr. Physical Design engineer @
- 2006 -2012 Sr. Physical and CAD engineer @ ChipX (acquired by Gigoptix)
- 2004 -2006 ASIC and VLSI physical design engineer @
- 2000 -2004 ASIC and VLSI engineer @
Daniel Talmon Education
- Technion - Israel Institute of Technology
Bachelor of Applied Science - BASc (Electrical, Electronics and Communications Engineering)
Daniel Talmon Skills
- Physical Verification
- ASIC
- EDA
- Physical Design
- IC
- Timing
- SoC
- VLSI
- TCL
- Static Timing Analysis
- Formal Verification
- Primetime
- Timing Closure
- Circuit Design
- Floorplanning
- Perl
- Semiconductors
- Characterization
- Application-Specific Integrated Circuits (ASIC)
- System on a Chip (SoC)
- Very-Large-Scale Integration (VLSI)
- Integrated Circuits (IC)
- Logic Synthesis
Daniel Talmon Summary
- Daniel Talmon, based in California, United States, is currently a Physical Design Lead at Rain AI. Daniel Talmon brings experience from previous roles at Aeva, Lightmatter, Innovium Inc. and Knowles Intelligent Audio. Daniel Talmon holds a Bachelor of Applied Science - BASc in Electrical, Electronics and Communications Engineering @ Technion - Israel Institute of Technology. With a robust skill set that includes Physical Verification, ASIC, EDA, Physical Design, IC and more. Daniel Talmon has 1 emails on RocketReach.
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