Sr. Physical Design engineer @ (January 2012 - January 2015)
Sr. Physical and CAD engineer @ ChipX (acquired by Gigoptix) (January 2006 - January 2012)
ASIC and VLSI physical design engineer @ (January 2004 - January 2006)
ASIC and VLSI engineer @ (January 2000 - January 2004)
Daniel Talmon Education
Technion - Israel Institute of Technology
Bachelor of Applied Science - BASc (Electrical, Electronics and Communications Engineering)
Daniel Talmon Skills
Physical Verification
ASIC
EDA
Physical Design
IC
Timing
SoC
VLSI
TCL
Static Timing Analysis
Formal Verification
Primetime
Timing Closure
Circuit Design
Floorplanning
Perl
Semiconductors
Characterization
Application-Specific Integrated Circuits (ASIC)
System on a Chip (SoC)
Very-Large-Scale Integration (VLSI)
Integrated Circuits (IC)
Logic Synthesis
Daniel Talmon Summary
Daniel Talmon, based in California, United States, is currently a Physical Design Lead at Rain AI. Daniel Talmon brings experience from previous roles at Aeva, Lightmatter, Innovium Inc. and Knowles Intelligent Audio. Daniel Talmon holds a Bachelor of Applied Science - BASc in Electrical, Electronics and Communications Engineering @ Technion - Israel Institute of Technology. With a robust skill set that includes Physical Verification, ASIC, EDA, Physical Design, IC and more. Daniel Talmon has 1 emails and 1 mobile phone numbers on RocketReach.
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