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Daniel Shir Location
New York, NY, US
Daniel Shir Work
Vice President of Engineering @ (November 2025 - Present)
Sr Director of Engineering, Head of Accounts @ (September 2023 - November 2025)
Director of Software Engineering @ (June 2023 - September 2023)
Member @ (June 2023 - Present)
Contributor @ (January 2021 - Present)
Co-Founder and CTO @ Acumen Labs (acquired by Via) (January 2019 - June 2023)
Media Lab Infrastructure Teacher and Advisor @ (October 2014 - April 2019)
Daniel Shir Education
Reichman University
BA (Computer Science)
2008-2010
Daniel Shir Skills
Algorithms
Amazon Web Services (AWS)
Android
Android Development
C
C#
C++
Design Patterns
Device Drivers
Distributed Systems
Eclipse
Entrepreneurship
Git
JSON
Java
JavaScript
Mobile Applications
Mobile Games
MongoDB
Multithreading
MySQL
NoSQL
OOP
Object Oriented Design
Objective-C
Open Source
OpenGL
PHP
Perl
Programming
Python
REST
Redis
Reverse Engineering
Ruby
Ruby on Rails
Scalability
Software Design
Software Development
Software Engineering
Start-ups
System Architecture
Web Applications
Win32 Dev
Xcode
iOS development
iPhone
iPhone development
node.js
x86 Assembly
Daniel Shir Summary
Daniel Shir, based in New York, NY, US, is currently a Vice President of Engineering at Via. Daniel Shir brings experience from previous roles at Via, PEF Community and GoRetro. Daniel Shir holds a 2008 - 2010 BA in Computer Science @ Reichman University. With a robust skill set that includes Algorithms, Amazon Web Services (AWS), Android, Android Development, C and more. Daniel Shir has 7 emails and 10 mobile phone numbers on RocketReach.
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