Daniel Nissinboim's Location
Israel
Daniel Nissinboim's Work
- Silicon validation @ Winbond
- RMA FA engineer @ Western Digital
- RMA FA engineer @ CSR
- Lab support integrator @ 迈韦尼通讯技术(上海)有限公司
Daniel Nissinboim's Education
- Holon Institute of Technology
B.Sc (Microelectronics)
2005 - 2010
Daniel Nissinboim's Skills
- Embedded Systems
- Debugging
- C#
- Visual Studio
- NI LabVIEW
- Semiconductor Failure Analysis
Daniel Nissinboim's Summary
Daniel Nissinboim, based in Israel, is currently a Silicon validation at Winbond, bringing experience from previous roles at Western Digital, CSR and Comverse. Daniel Nissinboim holds a 2005 - 2010 B.Sc in Microelectronics @ Holon Institute of Technology. With a robust skill set that includes Embedded Systems, Debugging, C#, Visual Studio, NI LabVIEW and more, Daniel Nissinboim contributes valuable insights to the industry. Daniel Nissinboim has 1 email on RocketReach.
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