2010 -2014 Packaging and Process Development Engineering Lead @
2006 -2010 Packaging Development Engineering Lead, Material Science @
2000 -2006 Process and Assembly Engineering Manager @ Spectrum Control
1985 -2000 Quality Assurance 6S Engineer @
Daniel Mendoza Education
SG College
Bachelor's degree (Mechanical Engineering)
CPM (MBB, Project Management, Lean Enterprise, Six Sigma)
Daniel Mendoza Skills
Design of Experiments
Die Attach, Wire Bonding, Hermetic Seal Process Optimization
Packaging Development ( Thermal/Mechanical Performance)
LED Lighting Technology Development
Yield Management and Enhancement
Leadership Development
Performance Tuning
Packaging
Semiconductors
Six Sigma
Wire Bonding
Die Attach
Process Optimization
FMEA
Manufacturing
Product Development
Materials Science
Project Management
SPC
Semiconductor Industry
R&D
Engineering
Lean Manufacturing
Materials
Failure Analysis
Yield
Process Simulation
JMP
Engineering Management
Product Engineering
Root Cause Analysis
Electronics Packaging
Thin Films
Process Engineering
Road Maps
Administrative Assistance
Team Building
Workforce
RF
Suppliers
Screening
Location
Net
Cost
5S
Plastics
Projectors
High Reliability
Performance Metrics
Coatings
Introducing
Minitab
Dec Alpha
Utilities
J Std 001
Projection
Stress
Incident Command
Value Stream Mapping
DFX
Conductivity
Procurement
Film
Benchmarking
Voice of the Customer
Silicones
Management
Die
Design
Si
Science
Continuous Improvement
Patents
General Electric
Statistics
Man Power
Metrics
Initiation
Spanish
Auditing
Coordinated
Taguchi
Monitors
In Process
Defense
Samsung
Human Resources
Bonds
Aluminum
Qualification
Elimination
Philadelphia
GMP
Discrete
Statistical Process Control Spc
Metals
Consumption
Oscillators
Charges
System
English
Supplier Quality
Variation
Belt
Iso 9000
Asia
Reports
ISO 9001
Crystal
Connecting
Boeing
Attainment
Strategies
Supplier Development
Testing
Transportation
Piloting
Acoustic
Training
Polymers
Failure Mode And Effects Analysis Fmea
Silver
Taiwan
Philippines
Solution
Robust
Mosfet
Assembly
Transitioning
Thermal
Rectifier
System Monitoring
Reporting
Quality Control
Commercial Real Estate
Radiation
Manufacturing Processes
Wafer
Wave Energy
Partnerships
Philips
Inspection
Cost Reduction
Automation
Auto
World Class
Concepts
Night Vision
Lean Deployment
Cut
Yield Management
Dimensional
Soldering
AutoCAD
Infineon
Sige
Project Engineering
Space
Motorola
Technical Aspects
Doors
Applications
Biomedical Engineering
Chinese
Floors
Mechanical
Schedules
Searching
Quality Assurance
Dfr
Nano
Operations
Production Facilities
Optical Materials
Increase Productivity
Quality System
Research And Development R&D
Microsoft Access
Yields
Risk Assessment
Marketing
Design for Manufacturing
Entertainment
Black Belt
Manufacturing Cost
Process Monitoring
Accelerated Life Testing
Business Intelligence
Technologist
Security Clearance
Project
ITAR
Distribution Center Operations
Surface
House
Launching
Nickel
Facilities Management
RoHS
Tear
JIT
Electro
Data Migration
Packaging Development Thermal/Mechanical Performance
Hermetic Seal Process Optimization
Power Devices
Alloys
Static
Statistical Software
Data Acquisition
Epoxy
GAAS
LinkedIn
Responsibility
Internal Audit
Usa
Targeted Advertising
Hazardous Substances
Qualifying
Packaging Development
International
Plating
Taiwanese
QS9000
Wire
Multi Tasking
Army
HEV
History
Feet
Start Ups
Power Products
Gold
Machine Tools
Prevention
Selections
Electronics
Process Improvement
Lenses
Raw Materials
Medical Devices
Field Operation
Outlook
Mechanical Engineering
Solder
WIP
Preventive Maintenance
Reflective
Throughput
Igbt
Lighting
Resistance
Program Management
Network Communications
Ceramic
Mil
Qualify
IPC
Mitsubishi
Vacuum
Marking
GaN
Deployed
Design Research
SMT
Mmic
Optimization
Aerospace
Quality Improvement
Problem Solving
Television
Hong Kong
Led Lighting Technology
High Power
Paradox
FDA
Deliveries
Discharge
Performance Management
Prototype
Product Quality
Databases
Statistical Process Control
Research and Development
Failure Mode and Effects Analysis
Daniel Mendoza Summary
Daniel Mendoza, based in Cambridge, MA, US, is currently a Distinguished Member of Technical Staff and Dept Lead at Draper. Daniel Mendoza brings experience from previous roles at BAE Systems, Inc., Infineon Technologies, Luminus Devices and Spectrum Control. Daniel Mendoza holds a Bachelor's degree in Mechanical Engineering @ SG College. With a robust skill set that includes Design of Experiments, Die Attach, Wire Bonding, Hermetic Seal Process Optimization, Packaging Development ( Thermal/Mechanical Performance), LED Lighting Technology Development, Yield Management and Enhancement and more. Daniel Mendoza has 3 emails and 1 mobile phone numbers on RocketReach.
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