Daniel Lindmark Location
- Chicago, IL, US
Daniel Lindmark Work
- 2022 - now Hardware Infrastructure Lead @
- 2013 - 2022 Lead of New Product Development @ MB Company
- 2006 - 2013 Senior Test Development Engineer @
- 2003 - 2006 Automated Test Design Engineer @ MPC Products
- 2000 - 2003 Test Engineer @
Daniel Lindmark Education
- Illinois Institute of Technology
Computer Engineering (Computer Engineering)
2000 - 2002 - Illinois Institute of Technology
Electrical Engineering (Electrical Engineering)
1996 - 2000
Daniel Lindmark Skills
- Data Acquisition
- Testing
- Software Development
- Electronics
- FPGA
- Analog
- Software Engineering
- Semiconductors
- Firmware
- Test Equipment
- Test Automation
- Automation
- Program Management
- SDLC
- Simulations
- Mixed Signal
- Debugging
- Electrical Engineering
- Embedded Systems
- C
- Sensors
- Orcad
- Hardware Architecture
- Circuit Designt
- Embedded Firmware Development
- PCB layout design
- Test Engineering
- Hardware
Daniel Lindmark Summary
- Daniel Lindmark, based in Chicago, IL, US, is currently a Hardware Infrastructure Lead at AllSpice. Daniel Lindmark brings experience from previous roles at MB Company, Teradyne, MPC Products and Argonne National Laboratory. Daniel Lindmark holds a 2000 - 2002 Computer Engineering in Computer Engineering @ Illinois Institute of Technology. With a robust skill set that includes Data Acquisition, Testing, Software Development, Electronics, FPGA and more. Daniel Lindmark has 2 emails and 2 mobile phone numbers on RocketReach.
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