Daniel Leija Email
Global Aftermarket Packaging Engineering Leader @ Cummins Inc.
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Daniel Leija Location
- Columbus, IN, US
Daniel Leija Work
- Global Aftermarket Packaging Engineering Leader @ (September 2024 - Present)
- LATAM Packaging Leader @ (May 2021 - September 2024)
- Global Supply Chain Oracle SU @ (June 2017 - May 2021)
- Supply Chain Functional Excellence Leader @ (June 2013 - May 2017)
- Project Manager and OE Plant Leader @ (November 2012 - May 2013)
- Suppy Chain Materials Leader @ (October 2011 - October 2012)
- Materials Manager .- Warehouse , Indirect Material, Logistics, Planning, Master Scheduling @ (June 2005 - September 2011)
- Warehouse and Packaging Leader @ (April 2003 - May 2005)
- Master Production Scheduler @ (January 2002 - March 2003)
- DC Gensets Project leader @ (August 2000 - December 2001)
- Materials Coordinator @ (May 1996 - July 2000)
- Materials Coordinator @ (May 1994 - April 1996)
- Planner and Buyer @ (January 1993 - April 1994)
Daniel Leija Education
- Instituto Tecnológico y de Estudios Superiores de Monterrey
Master of Business Administration (MBA) (Marketing internacional)
2003-2005 - University of Michigan
Certification (Value Stream Map)
2003-2004 - Universidad Autónoma de San Luis Potosí
BS Degree (Mechanical- Electrician Engineering)
1985-1991 - Instituto Potosino
Preparatoria (Fisico Matematicas)
1983-1985
Daniel Leija Summary
- Daniel Leija, based in Columbus, IN, US, is currently a Global Aftermarket Packaging Engineering Leader at Cummins Inc.. Daniel Leija brings experience from previous roles at Cummins Inc. and Cummins S de RL de CV. Daniel Leija holds a 2003 - 2005 Master of Business Administration (MBA) in Marketing internacional @ Instituto Tecnológico y de Estudios Superiores de Monterrey. Daniel Leija has 3 emails on RocketReach.
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