Daniel Krebs Email
Key Expert - III and V Chip Design and Integration: Novel Devices @ OSRAM
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Daniel Krebs Location
- Regensburg, BY, DE
Daniel Krebs Work
- Key Expert - III and V Chip Design and Integration: Novel Devices @ (June 2026 - Present)
- Principal Engineer, MicroLED and New Technologies @ (March 2024 - Present)
- Senior Chip Development Engineer @ (June 2023 - March 2024)
- Research Engineer, Power Semiconductors @ (April 2015 - June 2023)
- Researcher, Phase-Change Memory @ (May 2010 - December 2014)
- PhD @ (January 2006 - January 2010)
- Visiting Scientist @ (September 2006 - March 2008)
Daniel Krebs Education
- RWTH Aachen University
Dr. (Physik)
2001-2010
Daniel Krebs Skills
- AFM
- Dashboards
- Device Characterization
- Dünnschichttechnologie
- FEM analysis
- Finite-Elemente-Analyse
- Halbleiter
- IR spectroscopy
- LaTeX
- Material Characterisation
- Materials Science
- Matlab
- Memory
- Microsoft Power BI
- Nanotechnologie
- Nanotechnology
- Physics
- Physik
- Semiconductors
- Simulationen
- Simulations
- Sputter Deposition
- Thin Films
- XRR
- Finite Elemente Analyse
- Material
Daniel Krebs Summary
- Daniel Krebs, based in Regensburg, BY, DE, is currently a Key Expert - III and V Chip Design and Integration: Novel Devices at ams OSRAM. Daniel Krebs brings experience from previous roles at ams OSRAM, Bosch Research and IBM. Daniel Krebs holds a 2001 - 2010 Dr. in Physik @ RWTH Aachen University. With a robust skill set that includes AFM, Dashboards, Device Characterization, Dünnschichttechnologie, FEM analysis and more. Daniel Krebs has 1 emails on RocketReach.
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