Principal Functional Safety Engineer and Architecture for Automotive SoC - A2B and E2B @ Analog Devices
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Daniel Fu Location
United States
Daniel Fu Work
2023 -
now Principal Functional Safety Engineer and Architecture for Automotive SoC - A2B and E2B @
2022 -
2023 Principal Functional Safety Manager and Architecture for High End Automotive MCU and MPU @
2018 -
2022 Principal MTS -Automotive SOC and ASIC Functional safety and Product Quality Assurance @
2016 -
2018 Principal Hardware Engineer @
2016 -
2016 Staff Hardware Engineer @ Samsung Strategy and Innovation Center
2009 -
2016 Senior Hardware Engineer @
Daniel Fu Education
Universität der Bundeswehr München (UniBW -University Federal Armed Force Munich), Deutschland 2002null
Daniel Fu Skills
Functional Safety
PCB design
Adas
Wear Medical Device
Electronics
Embedded Systems
Hardware Architecture
RF
Circuit Design
Daniel Fu Summary
Daniel Fu, based in United States, is currently a Principal Functional Safety Engineer and Architecture for Automotive SoC - A2B and E2B at Analog Devices. Daniel Fu brings experience from previous roles at NXP Semiconductors, Analog Devices, ZF Group and Samsung Strategy and Innovation Center. Daniel Fu holds a Universität der Bundeswehr München (UniBW -University Federal Armed Force Munich), Deutschland. With a robust skill set that includes Functional Safety, PCB design, Adas, Wear Medical Device, Electronics and more. Daniel Fu has 1 emails and 1 mobile phone numbers on RocketReach.
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