Post Secondary Enrollment Options (PSEO)/Dual-Enrollment
2018 - 2021
Winona Senior High School
High School Diploma
2017 - 2021
University of Minnesota-Rochester
University of Minnesota Talented Youth Mathematics Program (UMTYMP)
2016 - 2018
Daniel Florness Skills
3D Printing
Active Listening
Agarose Gel Electrophoresis
Artificial Neural Networks
Aseptic Technique
Autodesk Fusion 360
C (Programming Language)
Cell Culture
Circuit Design
Computer-Aided Design (CAD)
Daniel Florness Summary
Daniel Florness, based in West Lafayette, IN, US, is currently a Intern - Instruments Assembly at BASi. Daniel Florness brings experience from previous roles at Parker Dewey, The Tap and GROUND ROUND. Daniel Florness holds a 2021 - 2025 Bachelor of Science - BS in Biomedical Engineering @ Purdue University. With a robust skill set that includes 3D Printing, Active Listening, Agarose Gel Electrophoresis, Artificial Neural Networks, Aseptic Technique and more. Daniel Florness has 1 emails on RocketReach.
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