Daniel Dinse Email

Lead Hardware Engineer @ [undisclosed]

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Daniel Dinse Location

Berlin, DE

Daniel Dinse Work

2026 - now Lead Hardware Engineer @ [undisclosed]
2024 - 2026 Lead Hardware Developer @ Incari Development Platform
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2025 - 2025 Senior Hardware Developer @ Convotherm
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2024 - 2024 Solution Manager @ Tria
2023 - 2023 Senior Hardware Developer @ ENGIE Energy Access (Africa)
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2022 - 2022 Senior Electrical Engineer @ JUCR
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2019 - 2022 Senior Hardware Developer @ Mitte
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2019 - 2019 Senior Electrical Engineer @ aiSight.ai
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2015 - 2019 Hardware Developer @ Native Instruments
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2008 - 2015 Hardwareingenieur @ Physikalisch-Technische Bundesanstalt, PTB
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Daniel Dinse Education

Beuth Hochschule für Technik Berlin (ehemals Technische Fachhochschule Berlin)
Diplom-Ingenieur (Elektrotechnik und Elektronik)
2003 - 2008

Daniel Dinse Summary

Daniel Dinse, based in Berlin, DE, is currently a Lead Hardware Engineer at [undisclosed]. Daniel Dinse brings experience from previous roles at Incari Development Platform, Convotherm, Avnet Embedded and Mobisol Group. Daniel Dinse holds a 2003 - 2008 Diplom-Ingenieur in Elektrotechnik und Elektronik @ Beuth Hochschule für Technik Berlin (ehemals Technische Fachhochschule Berlin).

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