Daniel Deng Location
California, United States
Daniel Deng Work
- 2017 - now Baseband Hardware Design Engineer @ Apple
- 2016 - 2017 Electrical Engineer @ Microsoft
- 2015 - 2015 Electrical Engineer Intern @ Microsoft
- 2014 - 2014 Verilog and DSP Modeling Engineering @ Microsemi Corporation
- 2013 - 2013 Hardware Engineering Coop @ IGNIS Innovation Inc.
- 2012 - 2012 Systems Debug Engineering Coop @ AMD
- 2012 - 2012 Computer Systems Assistant @ University of Waterloo
Daniel Deng Education
- University of Waterloo
Bachelor of Applied Science (BASc) (Electrical Engineering)
2011 - 2016
Daniel Deng Skills
- Hardware Architecture
- Soldering
- Analog Circuit Design
- Computer Hardware
- OrCAD Capture CIS
- Debugging
- Windows
- SPICE
- Microsoft PowerPoint
- RTL design
Daniel Deng Summary
Daniel Deng, based in California, United States, is currently a Baseband Hardware Design Engineer at Apple. Daniel Deng brings experience from previous roles at Microsoft, Microsemi and IGNIS Innovation Inc.. Daniel Deng holds a 2011 - 2016 Bachelor of Applied Science (BASc) in Electrical Engineering @ University of Waterloo. With a robust skill set that includes Hardware Architecture, Soldering, Analog Circuit Design, Computer Hardware, OrCAD Capture CIS and more. Daniel Deng has 2 emails and 1 mobile phone numbers on RocketReach.
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