2010 -
now HVM Test Architect and Technologist, Client SOC Development Group @
2005 -
2010 Sr. Director, Product Development and Test Engineering, Atom SOC Development Group @
2002 -
2005 Director, Product Development and Test Engineering, Networking and Communications Division @
1999 -
2002 Staff Product Development Engineer, Networking and Communications Division @
1991 -
1999 Sr. Product Development Engineer @
Daniel Clay Education
Illinois
Bachelor Of Science (Electrical Engineering)
1988
-
1992
Daniel Clay Summary
Daniel Clay, based in Portland, OR, US, is currently a Senior Leader and HVM Test Technologist at Intel Corporation. Daniel Clay brings experience from previous roles at Intel Corporation. Daniel Clay holds a 1988 - 1992 Bachelor Of Science in Electrical Engineering @ Illinois. Daniel Clay has 2 emails and 2 mobile phone numbers on RocketReach.
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