Daniel Arnitz Email
Principal Payload Engineer @ Extellis
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Daniel Arnitz Location
- Seattle, WA, US
Daniel Arnitz Work
- Principal Payload Engineer @ (August 2026 - Present)
- Senior Microwave and Payload Systems Engineer @ (March 2026 - August 2026)
- Hardware Group Lead @ (February 2019 - February 2026)
- Research Scientist and Metamaterials Specialist @ (October 2016 - January 2019)
- Research Associate (PostDoc) and Electrical Engineering @ (February 2014 - October 2016)
- Postdoctoral Associate (PostDoc) and Electrical Engineering @ (February 2012 - January 2014)
- Research Associate (PostDoc) and Electrical Engineering and Signal Processing @ (June 2011 - January 2012)
Daniel Arnitz Education
- Technische Universität Graz
Dr. techn. (Electrical Engineering / Signal Processing)
2005-2011 - FH JOANNEUM
Dipl.-Ing.(FH) (Industrial Electronics)
2001-2005 - HTL Saalfelden
(Power engineering and power electronics)
1995-2000
Daniel Arnitz Summary
- Daniel Arnitz, based in Seattle, WA, US, is currently a Principal Payload Engineer at Extellis. Daniel Arnitz brings experience from previous roles at Extellis, ThruWave Inc., Intellectual Ventures and University of Washington. Daniel Arnitz holds a 2005 - 2011 Dr. techn. in Electrical Engineering / Signal Processing @ Technische Universität Graz. Daniel Arnitz has 2 emails on RocketReach.
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Daniel Arnitz
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