Vice President Engineering Product Development @ (August 2021 - July 2023)
Principal Device Engineer @ (September 2005 - Present)
Senior Principal Device Engineer @ (May 1993 - August 2005)
Engineer @ MasPar (May 1990 - September 1991)
Dana Lee Education
Stanford University
MSEE (EE)
1991-1992
Massachusetts Institute of Technology
EECS
1989-1991
University of California, Berkeley
BS (EECS)
1984-1988
Dana Lee Skills
Quality Assurance
Reliability Engineering
Global Cross-Functional Team Leadership
Semiconductor Device
Simulations
Intellectual Property
Project Management
Semiconductors
Flash Memory
Semiconductor Industry
Testing
Semiconductor Device Reliability
ASIC
Physics
IC
Product Lifecycle Management
Cross-functional Team Leadership
Integrated Circuit Design
Test Engineering
Engineering Management
Integrated Circuits (IC)
Application-Specific Integrated Circuits (ASIC)
Dana Lee Summary
Dana Lee, based in Milpitas, CA, US, is currently a Senior Director, Engineering at Western Digital. Dana Lee brings experience from previous roles at Western Digital, SanDisk, Silicon Storage Technology and MasPar. Dana Lee holds a 1991 - 1992 MSEE in EE @ Stanford University. With a robust skill set that includes Quality Assurance, Reliability Engineering, Global Cross-Functional Team Leadership, Semiconductor Device, Simulations and more. Dana Lee has 4 emails and 3 mobile phone numbers on RocketReach.
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