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Dan Steinbach Location
Melville, NY, US
Dan Steinbach Work
Member of Technical Staff @ InterDigital (January 2001 - Present)
Principal Engineeer @ General DataComm (January 1996 - January 1998)
DSP Engineer @ (January 1988 - January 1996)
Dan Steinbach Education
Hofstra University
EMBA (Business)
2003-2005
Syracuse University
MS (Electrical Engineering)
1988-1990
Cornell University
BS (Electrical Engineering)
1984-1988
Stuyvesant High School 1980-1984
Dan Steinbach Skills
3G
3GPP
4G
ARM
ARM Architecture
C++
CDMA
Code Division Multiple Access Method (CDMA)
Digital Signal Processors
Embedded Systems
HSPA
IEEE 802.11
LTE
MIMO
Matlab
OFDM
PHY
RF
Simulations
UMTS
WCDMA
WiFi
Wireless
Wireless Technologies
Code Division Multiple Access Method Cdma
Code Division Multiple Access Method
Dan Steinbach Summary
Dan Steinbach, based in Melville, NY, US, is currently a Member of Technical Staff at InterDigital. Dan Steinbach brings experience from previous roles at General DataComm and Lockheed Martin. Dan Steinbach holds a 2003 - 2005 EMBA in Business @ Hofstra University. With a robust skill set that includes 3G, 3GPP, 4G, ARM, ARM Architecture and more. Dan Steinbach has 1 emails and 1 mobile phone numbers on RocketReach.
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