2011 -2013 Driver and Warehouse assistant @ G B Willbond Ltd
2010 -2010 Assistant IT Technician @ Nottingham Girls' Academy
2009 -2009 PCB Assembler @ ATE Solutions
Dan Lees Education
University of York 2008-2011
West Bridgford School 2006-2008
Dan Lees Skills
Programming
Circuit Design
Embedded Systems
Product Development
Product Design
User Interface Design
Product Lifecycle Management
Microcontrollers
Analog Circuit Design
Printed Circuit Board (PCB) Design
Design
User Experience (UX)
Engineering
Assembly Language
SolidWorks
Microchip PIC
Mechanical Product Design
Mechanical Drawings
BOM management
Waveform Generators
Graphical User Interface (GUI)
Schematic Capture
Ez80
Solutions
C Programming
Dan Lees Summary
Dan Lees, based in Warwick, GB, is currently a Hardware Engineer at ByteSnap Design. Dan Lees brings experience from previous roles at Newtons4th Ltd., G B Willbond Ltd, Nottingham Girls' Academy and ATE Solutions. Dan Lees holds a 2008 - 2011 University of York. With a robust skill set that includes Programming, Circuit Design, Embedded Systems, Product Development, Product Design and more. Dan Lees has 1 emails on RocketReach.
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