Dan Hamilton's Location
Anderson, SC, US
Dan Hamilton's Work
Dan Hamilton's Education
Clemson University
BS (Packaging Science)
2005 - 2009
Dan Hamilton's Skills
Dan Hamilton's Summary
Dan Hamilton, based in Anderson, SC, US, is currently a Packaging Engineer at Techtronic Industries, bringing experience from previous roles at SMC Packaging Group and PackIQ. Dan Hamilton holds a 2005 - 2009 BS in Packaging Science @ Clemson University. With a robust skill set that includes ArtiosCAD, Structural Engineering, PDMS, Mechanical Engineering and more, Dan Hamilton contributes valuable insights to the industry. Dan Hamilton has 1 email on RocketReach.