Dan Deisz Email & Phone Number
Vice President of Design Technology @ Rochester Electronics, LLC
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Dan Deisz Location
- Washington, DC, US
Dan Deisz Work
- Vice President of Design Technology @ (January 2023 - Present)
- Director of Design Technology @ (May 2014 - Present)
Dan Deisz Education
- University of Alabama
Bachelor Of Science In Electrical Engineering (Design)
1982-1984 - Northern Illinois University
(Physics)
1979-1982
Dan Deisz Skills
- ASIC
- Analog
- Analog Circuit Design
- Business Development
- CMOS
- Circuit Design
- Coaching
- Communication Skills
- DFT
- DRC
- Design Teams
- EDA
- Electronics
- Engineering Management
- FPGA
- Failure Analysis
- Functional Verification
- Hardware Architecture
- IC
- Integrated Circuit Design
- LVS
- Low-power Design
- Marketing
- Microelectronics
- Microprocessors
- Mixed Signal
- PLL
- Physical Design
- Physical Verification
- Primetime
- Product Development
- Product Management
- Program Management
- RTL design
- SERDES
- SRAM
- Semiconductor Industry
- Semiconductors
- Silicon
- SoC
- Static Timing Analysis
- Strategic Partnerships
- Teaching
- Team Leadership
- Technical Presentations
- Technology Marketing
- Test Engineering
- Timing Closure
- Verilog
- Written & Oral Presentation Skills
- Leadership
- Illustrator
- Business Analysis
- Management
- Low Power Design
- Written And Oral Presentation Skills
- InDesign
Dan Deisz Summary
- Dan Deisz, based in Washington, DC, US, is currently a Vice President of Design Technology at Rochester Electronics, LLC. Dan Deisz brings experience from previous roles at Rochester Electronics, LLC. Dan Deisz holds a 1982 - 1984 Bachelor Of Science In Electrical Engineering in Design @ University of Alabama. With a robust skill set that includes ASIC, Analog, Analog Circuit Design, Business Development, CMOS and more. Dan Deisz has 3 emails and 3 mobile phone numbers on RocketReach.
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