Dan Conder Email & Phone Number
Packaging Engineer @ QMC-EMI
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Dan Conder Location
- Novi, MI, US
Dan Conder Work
- Packaging Engineer @ (June 2017 - Present)
- Packaging Engineer @ (February 2011 - June 2017)
- Consultant @ (February 2010 - November 2010)
- Packaging Manager @ Behr America (January 2005 - May 2009)
- Packaging Engineering Manager @ Collins & Aikman (February 2002 - January 2005)
- Sr. Packaging Engineer @ Textron Automotive Company (June 2001 - February 2002)
- Program Manager @ I*Logic, Inc. (August 2000 - June 2001)
- Sr. Packaging Engineer @ Webasto Sunroofs, Inc. (June 1996 - August 2000)
- Packaging Engineer @ Electro-Wire Products (April 1992 - June 1996)
- Sr. Material Handling Engineer @ McDonnell Douglas Corp (September 1986 - February 1991)
- Manufacturing Engineer @ (January 1984 - January 1986)
- Packaging Specialist @ Hughes Aircraft Company (January 1982 - January 1984)
Dan Conder Education
- Michigan State University
B. S. (Packaging Engineering)
1976-1982
Dan Conder Skills
- ArtiosCAD
- Food Packaging
- Strategy
- Packaging
- Design for Manufacturing
Dan Conder Summary
- Dan Conder, based in Novi, MI, US, is currently a Packaging Engineer at Quality Metalcraft, Inc.. Dan Conder brings experience from previous roles at Eaton Corporation, Surgere, Inc., Behr America and Collins & Aikman. Dan Conder holds a 1976 - 1982 B. S. in Packaging Engineering @ Michigan State University. With a robust skill set that includes ArtiosCAD, Food Packaging, Strategy, Packaging, Design for Manufacturing and more. Dan Conder has 1 emails and 2 mobile phone numbers on RocketReach.
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