Dan Bonner Email & Phone Number
Senior Package Engineer @ Hillshire Brands
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Dan Bonner Location
- Downers Grove, IL, US
Dan Bonner Work
- Senior Package Engineer @ (February 2002 - Present)
- Senior Packaging Engineer @ (January 2002 - Present)
- Packaging Manager @ (February 1997 - February 2002)
Dan Bonner Education
- Purdue University
Dan Bonner Skills
- App V
- Application Packaging
- ThinApp
- Packaging Development
- Package Testing
- Packaging Machinery
Dan Bonner Summary
- Dan Bonner, based in Downers Grove, IL, US, is currently a Senior Package Engineer at Sara Lee Foods. Dan Bonner brings experience from previous roles at Sara Lee Foods and Ralcorp Holdings. Dan Bonner holds a Purdue University. With a robust skill set that includes App V, Application Packaging, ThinApp, Packaging Development, Package Testing and more. Dan Bonner has 1 emails on RocketReach.
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Top Hillshire Brands Employees
Ed Smith
VP Customer Marketing
Maineville, OH, US
Eric Birkhaug
Sr. Director, Customer Service and Logistics
Fayetteville, AR, US
Jim Murar
Director Of Engineering
Scottsdale, AZ, US
Alan Damron
Director-Continuous Improvement
Georgetown, KY, US
Martha Work
Director Packaging Innovation and Development
Chicago, IL, US
Dave Jones
VP Operations
Downers Grove, IL, US
Bruce Humbert
Senior Vice President Strategic Development
Cincinnati, OH, US
Mike Hayes
Vice President Customer Development
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