Dan Bonner Email & Phone Number
Senior Package Engineer @ Hillshire Brands
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Dan Bonner Location
- Downers Grove, IL, US
Dan Bonner Work
- 2002 -now Senior Package Engineer @
- 2002 -now Senior Packaging Engineer @
- 1997 -2002 Packaging Manager @
Dan Bonner Education
- Purdue University
Dan Bonner Skills
- App V
- Application Packaging
- ThinApp
- Packaging Development
- Package Testing
- Packaging Machinery
Dan Bonner Summary
- Dan Bonner, based in Downers Grove, IL, US, is currently a Senior Package Engineer at Sara Lee Foods. Dan Bonner brings experience from previous roles at Sara Lee Foods and Ralcorp Holdings. Dan Bonner holds a Purdue University. With a robust skill set that includes App V, Application Packaging, ThinApp, Packaging Development, Package Testing and more. Dan Bonner has 1 emails on RocketReach.
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Top Hillshire Brands Employees
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