Sr. Manager, Package Development @ (April 2017 - August 2026)
Sr. Staff Engineer, Package Platform Development @ (January 2015 - March 2017)
Sr. Staff Engineer, Package Development @ (August 2010 - December 2014)
Manager, Package Development @ (June 2007 - July 2010)
Sr. Engineer, Package Development @ (March 1999 - June 2007)
Dae Park Education
Hanyang University
BS (MS)
1993-1999
Dae Park Skills
Analog
Design of Experiments
Electronics
Failure Analysis
IC
JMP
Manufacturing
Microelectronics
Mixed Signal
Packaging
Product Engineering
SPC
Semiconductor Industry
Semiconductors
Silicon
Yield
Dae Park Summary
Dae Park, based in San Jose, CA, US, is currently a Advanced Packaging Technical Leader at Cisco. Dae Park brings experience from previous roles at Skyworks Solutions, Inc., International Rectifier an Infineon Technologies Company and ASE Group. Dae Park holds a 1993 - 1999 BS in MS @ Hanyang University. With a robust skill set that includes Analog, Design of Experiments, Electronics, Failure Analysis, IC and more. Dae Park has 2 emails and 1 mobile phone numbers on RocketReach.
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