Curt Lu Email
GMO Advanced Packaging Materials Supply Chain Engineer - POLY and WLA @ Intel Corporation
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Curt Lu Location
- Oregon, United States
Curt Lu Work
- GMO Advanced Packaging Materials Supply Chain Engineer - POLY and WLA @ (February 2026 - Present)
- LTD-M Back End Wet Etch Engineer @ (February 2023 - February 2026)
- Head of North America Dropshipping and Cross-Border Operations @ NINI international goodies (March 2024 - Present)
- Certified SEM user @ (November 2021 - December 2022)
- Certified HF Etch User @ (November 2021 - December 2022)
- Certified Cleanroom user @ (November 2021 - December 2022)
- Certified Filmetrics Thin Film Measurement System user @ (November 2021 - December 2022)
- Advanced TERS Near-Field Optics AFM Tips Research Assistant @ (November 2021 - December 2022)
- Certified CVD, PVD and ALD User @ (November 2021 - December 2022)
- Advanced STM Near-Field Optics Tips Research Assistant @ (November 2021 - December 2022)
- Research Assistant @ (July 2017 - May 2020)
- Project Assistant @ (June 2019 - April 2020)
- Project Assistant @ (March 2019 - November 2019)
- Project Assistant @ (February 2019 - November 2019)
- Project Manager @ (September 2018 - July 2019)
- Project Assistant @ (July 2017 - May 2018)
Curt Lu Education
- Columbia University
Master's degree (Mechanical Engineering)
2021-2022 - Feng Chia University
Bachelor's degree (Mechanical Engineering)
2016-2020
Curt Lu Skills
- Atomic Layer Deposition(ALD)
- Hydrofluoric etching
- Chemical Vapor Deposition (CVD)
- Design of Experiments (DOE)
- Scanning Electron Microscopy (SEM)
- Physical Vapor Deposition (PVD)
- Research
- MEMS
- Semiconductor Manufacture Process
- ANSYS
- python
- Finite Element Analysis (FEA)
- Injection Molding
- MOLDEX3D
- 3D Printing
- SOLIDWORKS
- Polypropylene
- Advanced Packaging
- Cost Structure Analysis
- Epoxy Molding Compound (EMC)
- Glass carrier wafers
- Root Cause Analysis
- Semiconductor Materials
- Semiconductor Process Technology
- Supplier Development
- Supplier Evaluation
- Supplier Quality Management
- Supplier Risk Management
- Temporary Bond / De-Bond
- WLA
- WLM
- Wet Chemical Etching
Curt Lu Summary
- Curt Lu, based in Oregon, United States, is currently a GMO Advanced Packaging Materials Supply Chain Engineer - POLY and WLA at Intel Corporation. Curt Lu brings experience from previous roles at Intel Corporation, NINI international goodies and Columbia University in the City of New York. Curt Lu holds a 2021 - 2022 Master's degree in Mechanical Engineering @ Columbia University. With a robust skill set that includes Atomic Layer Deposition(ALD), Hydrofluoric etching, Chemical Vapor Deposition (CVD), Design of Experiments (DOE), Scanning Electron Microscopy (SEM) and more. Curt Lu has 3 emails on RocketReach.
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Curt Lu
GMO Advanced Packaging Materials Supply Chain Engineer - POLY and WLA
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