CrossFire Technologies, Inc. Information

CrossFire Technologies Inc, a Silicon Catalyst Portfolio Company, is focused on providing Interposer alternatives for the silicon powering Generative and Physical AI hardware infrastructure. Generative AI Data Center Compute Infrastructure is currently built using multiple reticle size Chiplet die integrated into “SuperChips” using Interposers along with HBM or LPDDR5x memory. Due to cost, complexity and availability, Interposers have become the limiting factor in the deployment of AI compute silicon. Because of these limitations, SoCs built using Interposers are unable to meet the cost requirements of Agentic or Physical AI systems either. An Interposer alternative is needed. CrossFire offers a set of solutions to address these pain points. CrossFire’s Bridgelet products provide the Chiplet to Chiplet interconnect currently provided by Interposers, but without the cost, complexity or availability limitations. Depending on system requirements, Bridgelets can be either passive or active. Bridgelets are compatible with industry standard Die to Die (D2D) PHY’s such as UCIe and Bunch of Wires (BoW). Proprietary and non-standard D2D solutions such as Ultra Short Reach SerDes can also be used with Bridgelets. Bridgelets, Chiplets, and Memory are combined by using CrossFire’s proprietary OmniDie capability, which provides for the physical integration of Chiplets and other die into a conjoined group of die – the equivalent of a SuperChip. CrossFire has also developed a Chiplet Input / Output solution called Direct Chiplet Input / Output or DCIO. Compatible with standard link layers such as UCIe and the BoW link layer, implementations such as UCIe over DCIO can provide solutions that are 10x lower power, 10x lower cost, and 10x higher density than competing solutions.