CrossFire Technologies, Inc. Information

CrossFire Technologies INC, a Silicon Catalyst Portfolio Company, is enabling the Open Chiplet Economy with its Chiplet Design Suite. While Chiplets are becoming ubiquitous in AI SoC design, Chiplet adoption rates in other segments are constrained by several pain points. These include the unavailability of SoC building block Chiplets, Die to Die (D2D) interfaces that add too much cost, die area, and development time to Chiplet design, and the requirement for either costly and difficult to access Interposers or Ultra High-Density Package Substrates to integrate Chiplets into a unified MicroChip. In response, CrossFire offers a holistic Chiplet Design Suite to address these pain points. The CrossFire Direct Chiplet Interface (DCI) is 10x - 50x smaller, uses 10x less power, and can shave 6 - 12 months off of a project's development schedule due to its simplicity compared to other Die to Die Interface offerings. Bridgelets are ready to use system interface functions such as Memory Controllers, System Component Interfaces, and Network Interfaces that include CrossFire's DCI Die to Die Interface. Bridgelets are available via the Open Chiplet Marketplace and available to all to integrate into their Chiplet based systems. Pulling it all together, CrossFire offers OmniDie™, a unique approach to chiplet integration that does not require interposers or a costly High-Density package Substrates. With OmniDie, customers avoid interposer availability constraints and other expensive alternatives, saving development time and money. CrossFire is a privately held fabless semiconductor company with executive offices located in the Minneapolis / St. Paul area of Minnesota and a satellite office in the Research Triangle Park area of North Carolina