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Craig Findlay Location
Edinburgh, Scotland, GB
Craig Findlay Work
2021 -now Chief Mechanical Analysis Engineer @
2013 -2021 Lead Thermal Engineer @
2001 -2013 Principal Thermal Engineer @
2000 -2001 Mechanical Engineer @
1997 -2000 Electronics Packaging Engineer @ McLaren Electronic Systems
1993 -1997 Thermal Engineer @ GEC Ferranti
Craig Findlay Education
University of Abertay Dundee
BEng. Hons. (Mechanical Engineering)
1987-1992
Forfar Academy 1981-1987
Craig Findlay Skills
Heat Transfer
Fluid Mechanics
Thermal Management
Thermal Analysis
Thermal
Thermal Design
Fluid Dynamics
CFD
ANSYS
Pro/Engineer
Finite Element Analysis
Simulation
Electronics Packaging
Thermal Engineering
Thermodynamics
Cooling
MathCAD
Engineering
Composites
Nastran
Stress Analysis
Aerospace
Numerical Analysis
Mechanical Engineering
Solidworks
Engineering Management
CAD
Fortran
Fatigue Analysis
CAE
Systems Engineering
PTC Pro/Engineer
Simulations
Catia
Design for Manufacturing
PTC Creo
Microsoft Excel
Project Management
SQL
Craig Findlay Summary
Craig Findlay, based in Edinburgh, Scotland, GB, is currently a Chief Mechanical Analysis Engineer at Leonardo. Craig Findlay brings experience from previous roles at Leonardo, Artesyn Technologies and McLaren Electronic Systems. Craig Findlay holds a 1987 - 1992 BEng. Hons. in Mechanical Engineering @ University of Abertay Dundee. With a robust skill set that includes Heat Transfer, Fluid Mechanics, Thermal Management, Thermal Analysis, Thermal and more. Craig Findlay has 3 emails on RocketReach.
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