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Connor Erwin Location
Menomonie, WI, US
Connor Erwin Work
2024 -now Packaging Engineer II @
2022 -2024 Packaging Engineer @
2022 -2022 Night Stocker @
2021 -2022 Packaging Engineer Co-op @
2020 -2020 Packaging Engineer @
2018 -2020 Production Employee @
Connor Erwin Education
University of Wisconsin-Stout
Bachelor of Science - BS (Packaging)
2018-2022
Memorial high school
High School Diploma
2011-2015
Connor Erwin Skills
Packaging Engineering
Adobe Illustrator
Agile PLM
SAP PLM
Documentation
Project Management
Research
Analytical Skills
Engineering
Communication
Quality Control
Adaptability
Leadership
Conflict Resolution
Troubleshooting
Microsoft Office
ISO 9001
Continuous Improvement
Connor Erwin Summary
Connor Erwin, based in Menomonie, WI, US, is currently a Packaging Engineer II at Medtronic. Connor Erwin brings experience from previous roles at Medtronic, Walmart, Inland: We Power Great Packaging and Boston Scientific. Connor Erwin holds a 2018 - 2022 Bachelor of Science - BS in Packaging @ University of Wisconsin-Stout. With a robust skill set that includes Packaging Engineering, Adobe Illustrator, Agile PLM, SAP PLM, Documentation and more. Connor Erwin has 2 emails on RocketReach.
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