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Colin Kirk Location
Le Roy, NY, US
Colin Kirk Work
Packaging Engineer @ (August 2025 - Present)
Packaging Dynamics Lab Technician @ (April 2024 - May 2025)
Teaching Assistant @ (January 2024 - May 2025)
Packaing Materials Lab Technician @ (January 2024 - May 2024)
Global Design and Packaging Intern @ (June 2023 - December 2023)
Information Technology Specialist @ Tolland Public Schools (September 2020 - May 2023)
Information Technology Intern @ Tolland Public Schools (June 2019 - September 2020)
Colin Kirk Education
Rochester Institute of Technology
Bachelor's degree (Packaging Science)
2021-2025
Colin Kirk Skills
ASTM
ASTM standards
Adobe Illustrator
ArtiosCAD
Forklift Operation
ISTA
Problem Solving
SOLIDWORKS
Team Leadership
Zund
Colin Kirk Summary
Colin Kirk, based in Le Roy, NY, US, is currently a Packaging Engineer at OrCon Industries Corp.. Colin Kirk brings experience from previous roles at Rochester Institute of Technology and Colgate-Palmolive. Colin Kirk holds a 2021 - 2025 Bachelor's degree in Packaging Science @ Rochester Institute of Technology. With a robust skill set that includes ASTM, ASTM standards, Adobe Illustrator, ArtiosCAD, Forklift Operation and more. Colin Kirk has 1 emails on RocketReach.
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