Cliff Lee Location
Redmond, WA, US
Cliff Lee Work
Cliff Lee Education
Cornell University
M.Eng., Electrical and Computer Engineering
University of Washington
BSEE, Electrical Engineering
Cliff Lee Skills
Cliff Lee Summary
Cliff Lee, based in Redmond, WA, US, is currently a Principal Engineer, Silicon Packaging at Microsoft. Cliff Lee brings experience from previous roles at Microsoft and Intel Corporation. Cliff Lee holds a M.Eng., Electrical and Computer Engineering @ Cornell University. With a robust skill set that includes Logic Design, SoC, SPICE, ASIC, Processors and more. Cliff Lee has 3 emails and 2 mobile phone numbers on RocketReach.