Cliff Lee Email & Phone Number
Principal Engineer, Silicon Packaging @ Microsoft
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Cliff Lee Location
- Redmond, WA, US
Cliff Lee Work
- 2013 -2020 PCB Technologist, Hardware Business and Manufacturing @
- 2021 -now Principal Engineer, Silicon Packaging @
- 2020 -2021 System Architect, Cryogenic Engineering @
- 2005 -2013 Engineering Manager, IC Packaging Design @
- 2002 -2005 Engineering Manager, PCI Express® Signal Integrity @
- 1998 -2002 Senior Staff Engineer, Platform Signal Integrity @
- 1995 -1998 Senior Hardware Engineer, PCB design @
- 1991 -1995 Hardware Engineer, x86 platform validations @
Cliff Lee Education
- Cornell University
M.Eng., Electrical and Computer Engineering
- University of Washington
BSEE, Electrical Engineering
Cliff Lee Skills
- Logic Design
- SoC
- SPICE
- ASIC
- Processors
- PCIe
- Microprocessors
- Program Management
- Technical Staff Management
- Cadence
- IC packaging
- Customer Engagement
- Intel Architecture
- Signal Integrity
- PCB design
- Product Road Mapping
- Cross-functional Team Leadership
- Intel
- Computer Architecture
- Low-power Design
- IC
- Simulations
- Strategic Sourcing
- Global Sourcing
- Power Delivery
- Hardware Architecture
- Semiconductors
- Testing
- Integrated Circuits (IC)
- System on a Chip (SoC)
- Application-Specific Integrated Circuits (ASIC)
- System on a Chip Soc
- Integrated Circuits Ic
- Cross Functional Team Leadership
- Low Power Design
- Integrated Circuits
- System on a Chip
Cliff Lee Summary
- Cliff Lee, based in Redmond, WA, US, is currently a Principal Engineer, Silicon Packaging at Microsoft. Cliff Lee brings experience from previous roles at Microsoft and Intel Corporation. Cliff Lee holds a M.Eng., Electrical and Computer Engineering @ Cornell University. With a robust skill set that includes Logic Design, SoC, SPICE, ASIC, Processors and more. Cliff Lee has 3 emails and 3 mobile phone numbers on RocketReach.
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