Chu-Hsuan Sha's Location

Hillsboro, OR, US

Chu-Hsuan Sha's Education

  • UC Irvine

    Doctor of Philosophy - PhD (Materials and Manufacturing Technology)

    2007 - 2011
  • University of Florida

    Master of Science - MS (Materials Science and Engineering)

    2005 - 2007
  • 國立臺灣大學

    Bachelor of Science - BS (Materials Science and Engineering)

    2001 - 2005

Chu-Hsuan Sha's Skills

  • Materials Bonding
  • Flip-Chip Interconnect
  • Electronic Packaging
  • Plasma Etching
  • Manufacturing
  • Flip Chip Interconnect

Chu-Hsuan Sha's Summary

Chu-Hsuan Sha, based in Hillsboro, OR, US, is currently a Module Engineer at Intel Corporation. Chu-Hsuan Sha holds a 2007 - 2011 Doctor of Philosophy - PhD in Materials and Manufacturing Technology @ UC Irvine. With a robust skill set that includes Materials Bonding, Flip-Chip Interconnect, Electronic Packaging, Plasma Etching, Manufacturing and more, Chu-Hsuan Sha contributes valuable insights to the industry. Chu-Hsuan Sha has 2 emails on RocketReach.
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