2002 -2004 Vice President, System-in-Package Business Unit @
1999 -2002 Product Manager and Director, Advanced Products @
1997 -1999 Manager, Flip-chip CSP Development and Deployment @
1994 -1997 Process Engineering Manager @
Chris Scanlan Education
University of Wisconsin-Milwaukee
Master of Science - MS (Materials Engineering)
1993-1994
University of Wisconsin-Milwaukee
Bachelor of Science - BS (Materials Science & Engineering)
1987-1992
Chris Scanlan Skills
Project Management
Semiconductors
WLP
Product Engineering
Failure Analysis
IC
Semiconductor Industry
Design of Experiments
Engineering Management
Reliability
SPC
Product Development
Intellectual Property
R&D
FMEA
8D Problem Solving
MEMS
Characterization
Six Sigma
Manufacturing
Product Management
Program Management
Process Simulation
Sensors
Analog
Mixed Signal
Process Engineering
Electronics
ASIC
RF
Thin Films
Engineering
Wireless
SoC
Integrated Circuits (IC)
Management
Project Planning
Team Leadership
Chris Scanlan Summary
Chris Scanlan, based in Steinhausen, ZG, CH, is currently a Senior Vice President, Technology at Besi Switzerland AG. Chris Scanlan brings experience from previous roles at JCET Group Co., Ltd., Deca Technologies and Amkor Technology. Chris Scanlan holds a 1993 - 1994 Master of Science - MS in Materials Engineering @ University of Wisconsin-Milwaukee. With a robust skill set that includes Project Management, Semiconductors, WLP, Product Engineering, Failure Analysis and more. Chris Scanlan has 2 emails on RocketReach.
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