Vice President, WW Field Applications Engineering @ (April 2019 - November 2020)
Senior Vice President - Product Development @ (December 2009 - April 2019)
Vice President, Applications Engineering @ (January 2008 - December 2009)
VP, Research and Development @ (September 2004 - December 2007)
Vice President, System-in-Package Business Unit @ (July 2002 - October 2004)
Product Manager and Director, Advanced Products @ (February 1999 - June 2002)
Manager, Flip-chip CSP Development and Deployment @ (May 1997 - February 1999)
Process Engineering Manager @ (April 1994 - May 1997)
Chris Scanlan Education
University of Wisconsin-Milwaukee
Master of Science - MS
1993-1994
University of Wisconsin-Milwaukee
Bachelor of Science - BS
1987-1992
Chris Scanlan Skills
Project Management
Semiconductors
WLP
Product Engineering
Failure Analysis
IC
Semiconductor Industry
Design of Experiments
Engineering Management
Reliability
SPC
Product Development
Intellectual Property
R&D
FMEA
8D Problem Solving
MEMS
Characterization
Six Sigma
Manufacturing
Product Management
Program Management
Process Simulation
Sensors
Analog
Mixed Signal
Process Engineering
Electronics
ASIC
RF
Thin Films
Engineering
Wireless
SoC
Integrated Circuits (IC)
Management
Project Planning
Team Leadership
Chris Scanlan Summary
Chris Scanlan, based in Steinhausen, ZG, CH, is currently a Senior Vice President, Technology at Besi Switzerland AG. Chris Scanlan brings experience from previous roles at JCET Group Co., Ltd., Deca Technologies and Amkor Technology. Chris Scanlan holds a 1993 - 1994 Master of Science - MS @ University of Wisconsin-Milwaukee. With a robust skill set that includes Project Management, Semiconductors, WLP, Product Engineering, Failure Analysis and more. Chris Scanlan has 2 emails on RocketReach.
Looking for a different Chris Scanlan?
Find contact details for 700 million professionals.