Chris Scanlan Location
Steinhausen, ZG, CH
Chris Scanlan Work
- 2020 - now Senior Vice President, Technology @ Besi Switzerland AG
- 2019 - 2020 Vice President, WW Field Applications Engineering @ STATS ChipPAC
- 2009 - 2019 Senior Vice President - Product Development @ Deca Technologies
- 2008 - 2009 Vice President, Applications Engineering @ Amkor Technology, Inc.
- 2004 - 2007 VP, Research and Development @ Amkor Technology, Inc.
- 2002 - 2004 Vice President, System-in-Package Business Unit @ Amkor Technology, Inc.
- 1999 - 2002 Product Manager and Director, Advanced Products @ Amkor Technology, Inc.
- 1997 - 1999 Manager, Flip-chip CSP Development and Deployment @ Motor X
- 1994 - 1997 Process Engineering Manager @ Motor X
Chris Scanlan Education
- University of Wisconsin-Milwaukee
Master of Science - MS (Materials Engineering)
1993 - 1994 - University of Wisconsin-Milwaukee
Bachelor of Science - BS (Materials Science & Engineering)
1987 - 1992
Chris Scanlan Skills
- Project Management
- Semiconductors
- WLP
- Product Engineering
- Failure Analysis
- IC
- Semiconductor Industry
- Design of Experiments
- Engineering Management
- Reliability
Chris Scanlan Summary
Chris Scanlan, based in Steinhausen, ZG, CH, is currently a Senior Vice President, Technology at Besi Switzerland AG. Chris Scanlan brings experience from previous roles at JCET Group Co., Ltd., Deca Technologies and Amkor Technology. Chris Scanlan holds a 1993 - 1994 Master of Science - MS in Materials Engineering @ University of Wisconsin-Milwaukee. With a robust skill set that includes Project Management, Semiconductors, WLP, Product Engineering, Failure Analysis and more. Chris Scanlan has 2 emails on RocketReach.
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Top Besi Switzerland AG Employees
-
Thomas Lokay
Vice President Strategic Supply Chain at Besi Switzerland AG
Steinhausen, ZG, CH1 -
Philipp von Rickenbach
Director Corporate Finance at Besi Switzerland AG
Steinhausen, ZG, CH1 -
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Guillaume Mösching
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Mechanical Engineer at Besi Switzerland AG
Zürich, ZH, CH1
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