Packaging Engineer @ (October 2011 - December 2015)
Lead Mechanical Engineer @ (July 2005 - September 2011)
Sr. Mechanical Engineer @ (June 2002 - June 2005)
Mechanical Engineer @ (February 2001 - December 2001)
Product Engineer @ (January 1994 - January 2001)
Chris Hermanson Education
Oakland University
M.S. (Mechanical Engineering)
1994-1996
University of Michigan
B.S. (Chemical Engineering)
1990-1994
Chris Hermanson Skills
Solidworks
Design for Manufacturing
GD&T
FMEA
AutoCAD
Kaizen
CNC manufacturing
Engineering
Engineering Management
Product Development
Failure Analysis
Electronics Packaging
ANSYS
Finite Element Analysis
Semiconductors
Design of Experiments
RF
Root Cause Analysis
Continuous Improvement
Simulations
PCB design
Plastics
Testing
Mechanical Engineering
Leadership
Packaging
Cnc
Requirements Analysis
Structural Analysis
Structural
Marketing
Parts
Design
Thermal
Chris Hermanson Summary
Chris Hermanson, based in Durham, NC, US, is currently a Principal Packaging Design Engineer at Cubic Nuvotronics. Chris Hermanson brings experience from previous roles at Wolfspeed, Cobham Sensor Systems, Microwave Electronics, Hydranautics and Wingcast. Chris Hermanson holds a 1994 - 1996 M.S. in Mechanical Engineering @ Oakland University. With a robust skill set that includes Solidworks, Design for Manufacturing, GD&T, FMEA, AutoCAD and more. Chris Hermanson has 1 emails and 2 mobile phone numbers on RocketReach.
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