2016 -2020 VP of Assembly Operations, VP of of Sales and Engineering, Dir of Engineering @
2013 -2016 MEMS Global Sourcing Manager, MEMS Mfg'g Engineer @ Amphenol Advanced Sensors/formerly GE Sensing
2010 -2012 Strategic Sourcing Program Manager @
2009 -2009 Package Engineering Manager @
2008 -2009 Program Manager @
2000 -2008 Sr Mgr Subcontract Assembly and Test, Offshore Operations Mgr, RF and Analog Program Mgr @
2000 -2000 Mgr Package and Assembly @
1999 -2000 Sr Mgr Offshore Operations @
1997 -1999 Mgr BGA Package Design @
1995 -1997 Mgr Package, Assembly and Quality @ PCSI
1994 -1995 Sr Package Engineer @ Rockwell Semiconductor Systems
1992 -1994 Package Development Engineer @ Silicon Systems
1990 -1992 Advanced Package Engineer @ Brooktree
1984 -1990 Package and Manufacturing Engineer @ TRW LSI Products & TRW Military Electronics
Chip Greely Education
UC San Diego
BA (Economics)
UC San Diego
BS (Applied Mechanics (ME))
Chip Greely Skills
Semiconductors
IC
Manufacturing
Engineering
Electronics
Program Management
Engineering Management
Cross-functional Team Leadership
Semiconductor Industry
Consumer Electronics
Design of Experiments
RF
Testing
Supply Chain
Matrix Management
Analog
SPC
Software Documentation
Strategic Sourcing
Operations Management
Six Sigma
Process Engineering
Supply Management
Quality System
Continuous Improvement
Design for Manufacturing
Integration
Iteration
Product Development
CDMA
Contract Manufacturing
Focal Point
Vendor Managed Inventory
Rockwell
VMI
Silicon
Direct Management
Sensors
Vendors
Mechanical Engineering
Project
Asset Allocation
Cell
Pricing
Assurance
Design Review
Stocking
Hand Tools
Asia
Applied Mechanics
Wafer
Chip
Back End
Simulations
Cirrus
Singapore
Qualcomm
Thermal Analysis
Flip Chip
Relationship Management
Aid
Inventory
Foundry Management
Science
Documentation
Procurement
ERP
Auditing
Shanghai
Recover
Boms
Design
TAM
Risk Management
Global Sourcing
Medicine
SAT
Third Party Applications
Factory
Circuit
Source
Outsourcing
San Diego
Inventory Control
Ecn
EMS
Commodities
Loading
House
Meetings
Economics
Bonded
Art
Offshore Operations
Assembly
Test Management
Test Strategy
Negotiation
Project Planning
Eco
Sales Plan
Test Equipment
Manufacturing Operations
Real Estate Transactions
Tape
Pipelines
Facilities Management
Illness
Roadmap
Taiwan
Oracle Enterprise Manager
Performance Improvements
Human Resources
Bga
Hardware
Delivery
Packaging Engineering
Price Setting
Schedules
Solution
Coordinate
Electricians
Sourcing
Communication
Retail
Malaysia
Stocks
Ceramic
Cross Functional Team Leadership
Assembly Language
Financial Forecasting
Packaging
Suppliers
Rolling
Materials
Responsibility
Obtain
Supply
Logic
Cost Reduction
Flotherm
Closure
Microsoft Excel
Pricing Strategy
Layout
PCB design
Korea
Root Cause Analysis
Expedite
ISO 13485
Strategy
Process Implementation
Foundries
Problem Solving
Sourced
Offshore
MEMS
Cross Functional Team
Microsoft Project
Revisions
Management
Projection
Consolidation
Onboarding
Product Lines
Cadence
Chip Greely Summary
Chip Greely, based in Santa Clara, CA, US, is currently a Head of Package and Assembly at nEye.ai. Chip Greely brings experience from previous roles at CHIP's, Ayar Labs, Promex Industries Inc. and Nokia. Chip Greely holds a BA in Economics @ UC San Diego. With a robust skill set that includes Semiconductors, IC, Manufacturing, Engineering, Electronics and more. Chip Greely has 2 emails on RocketReach.
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