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Chin Ng Location
Bayan Lepas, MY
Chin Ng Work
2023 -now Director of ITVG Testchip Malaysia Engineering Team @
2019 -2023 Director of Engineering IPG AMS Memory and Testchip Group (Malaysia) @
2011 -2019 Engineering Manager of IPG APAC MYS D2D On Package IO @
2010 -2011 Project Execution Lead @
2003 -2009 Static Memory Design Lead @
Chin Ng Education
Multimedia University
Bachelor's degree (Electrical and Electronics Engineering)
1999-2003
Chin Ng Skills
Application Specific Integrated Circuits Asic
Debugging
Sales
Cross Functional Team Leadership
Physical Design
Establishing Strategic Partnerships
People Development
Strategic Leadership
Project Management
Product Development
Microsoft Excel
Verilog
Semiconductors
SQL
Inspiring People
Strategic Planning
Engineering
Mixed Signal
IC
InDesign
Ip Roadmap Planning
SoC
Analytical Skills
BLS
ASIC
Engineering Management
EDA
Application Specific Integrated Circuits
Chin Ng Summary
Chin Ng, based in Bayan Lepas, MY, is currently a Director of ITVG Testchip Malaysia Engineering Team at Intel Corporation. Chin Ng brings experience from previous roles at Intel Corporation. Chin Ng holds a 1999 - 2003 Bachelor's degree in Electrical and Electronics Engineering @ Multimedia University. With a robust skill set that includes Application Specific Integrated Circuits Asic, Debugging, Sales, Cross Functional Team Leadership, Physical Design and more. Chin Ng has 3 emails and 2 mobile phone numbers on RocketReach.
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